Since the side edges of wall and floor tiles will be uncontrollably deformed after sintering, the edging method is often used to ensure their strict dimensional requirements. The grinding parameters (grinding depth, forward speed and rotation speed) of the edge grinding grains of wall and floor tiles were studied by using discrete element method, where the influence of the grinding parameters on the grinding force was analyzed. It is demonstrated that the grinding force is increased with increasing grinding depth. When the depth is 10 μm, the removal behavior is ductile type, while it is converted to brittle one, as the depth is greater than 10 μm. The advance speed has a weak effect on the grinding force. When it is greater than 90π rad·s⁻¹, the removal is the most efficient. The effect of speed of rotation on the grinding force is also not pronounced. The grinding force in the grinding process directly affects the grinding quality of the grinding surface. This study can be used as a reference to select reasonable process parameters.

This paper was aimed to address the serious issues of over-polishing and under-polishing in the production of ceramic tiles, which significantly affect product quality. Mathematical models were established to correlate polishing process parameters and motion parameters with variables related to over-polishing and under-polishing, based on the Preston equation and the grinding head outer profile trajectory equation. According to the simulation analysis results, it is revealed that over-polishing primarily occurs in the overlapping regions of the polishing trajectory, with a smaller proportion distributed in the upper and lower arc regions of the trajectory. As the polishing process parameters are modified, an increase in the width of the leak-free polishing zone corresponds to an enlargement of the overlapping area. It is possible to reduce the width of the leak-free polishing zone by 17.91%, simultaneously resulting in a 53.06% reduction in the overlapping area, by adjusting the polishing process parameters. This significant improvement effectively enhances the over-polishing situation, markedly promoting grinding uniformity. These findings offer a theoretical foundation for optimizing polishing trajectories in practical production of ceramic tiles.