Single Abrasive Grinding Parameters of Wall and Floor Tiles Based on Discrete Element Method

Since the side edges of wall and floor tiles will be uncontrollably deformed after sintering, the edging method is often used to ensure their strict dimensional requirements. The grinding parameters (grinding depth, forward speed and rotation speed) of the edge grinding grains of wall and floor tiles were studied by using discrete element method, where the influence of the grinding parameters on the grinding force was analyzed. It is demonstrated that the grinding force is increased with increasing grinding depth. When the depth is 10 μm, the removal behavior is ductile type, while it is converted to brittle one, as the depth is greater than 10 μm. The advance speed has a weak effect on the grinding force. When it is greater than 90π rad·s⁻¹, the removal is the most efficient. The effect of speed of rotation on the grinding force is also not pronounced. The grinding force in the grinding process directly affects the grinding quality of the grinding surface. This study can be used as a reference to select reasonable process parameters.