Influence of Single Grinding Head Ceramic Tile Polishing Process Parameters on Grinding Uniformity

This paper was aimed to address the serious issues of over-polishing and under-polishing in the production of ceramic tiles, which significantly affect product quality. Mathematical models were established to correlate polishing process parameters and motion parameters with variables related to over-polishing and under-polishing, based on the Preston equation and the grinding head outer profile trajectory equation. According to the simulation analysis results, it is revealed that over-polishing primarily occurs in the overlapping regions of the polishing trajectory, with a smaller proportion distributed in the upper and lower arc regions of the trajectory. As the polishing process parameters are modified, an increase in the width of the leak-free polishing zone corresponds to an enlargement of the overlapping area. It is possible to reduce the width of the leak-free polishing zone by 17.91%, simultaneously resulting in a 53.06% reduction in the overlapping area, by adjusting the polishing process parameters. This significant improvement effectively enhances the over-polishing situation, markedly promoting grinding uniformity. These findings offer a theoretical foundation for optimizing polishing trajectories in practical production of ceramic tiles.