Large-scale synthesis of high-quality two-dimensional (2D) semiconductors, such as molybdenum disulfide (MoS2), is a prerequisite for their lab-to-fab transition. It is crucial to systematically explore and understand the influence of key synthetic conditions on the nucleation, uniformity, and quality of MoS2 wafers. Here, we report the epitaxial growth of high-quality and uniform monolayer MoS2 films on 2-in c-plane sapphire by chemical vapor deposition (CVD) method under optimized growth conditions (0–1 mg NaCl, adequate S/Mo ratio, and the addition of 0–1 sccm O2). We systematically explore the influence of critical synthetic conditions on the nucleation, and stitching of MoS2 domains over the wafer scale, including the dosage of the alkali metal salt NaCl additive, the evaporation temperature of MoO3, the distance between MoO3 and the substrate, and the flow rate of O2. Among them, the dosage of NaCl and the S/Mo ratio have important influences on the quality and film coverage of MoS2, while the flow rate of O2 plays a key role in controlling the nucleation density and domain size. We further discovered that a-plane sapphire could easily guide the unidirectional growth of MoS2 without the need for other specific synthetic conditions compared with c-plane and m-plane sapphire. The field-effect transistors (FETs) fabricated from the full-coverage films show an average and the highest mobilities of 28.5 and around 45 cm2·V−1·s−1, respectively.
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High-performance field-effect transistors (FETs) based on atomically thin two-dimensional (2D) semiconductors have demonstrated great promise in post-Moore integrated circuits. However, unipolar p-type 2D semiconductor transistors yet remain challenging and suffer from low saturation current density (less than 10 μA·μm–1) and high contact resistance (larger than 100 kΩ·μm), mainly limited by the Schottky barrier induced by the mismatch of the work-functions and the Fermi level pinning at the metal contact interfaces. Here, we overcome these two obstacles through van der Waals (vdW) integration of high work-function metal palladium (Pd) as the contacts onto monolayer WSe2 grown by chemical vapor deposition (CVD) method. We demonstrate unipolar p-type monolayer WSe2 FETs with superior device performance: room temperature on-state current density exceeding 100 μA·μm–1, contact resistance of 12 kΩ·μm, on/off ratio over 107, and field-effect hole mobility of ~ 103 cm2·V–1·s–1. Electrical transport measurements reveal that the Fermi level pinning effect is completely effectively eliminated in monolayer WSe2 with vdW Pd contacts, leading to a Schottky barrier-free Ohmic contact at the metal-semiconductor junctions. Combining the advantages of large-scale vdW contact strategy and CVD growth, our results pave the way for wafer-scale fabrication of complementary-metal-oxide-semiconductor (CMOS) logic circuits based on atomically thin 2D semiconductors.
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