Fiber-reinforced composites that integrate efficient and broadband electromagnetic wave (EMW) absorption with structural load-bearing capability have attracted considerable attention for radar-stealth applications. However, achieving effective absorption in the low-frequency band (< 8 GHz) remains challenging for dielectric-loss-dominated absorbers due to the long wavelength, which hinders the simultaneous realization of impedance matching and sufficient attenuation. Herein, we propose a SiC_f/GF hybrid woven metacomposite, in which EMW-transparent glass fiber (GF) is hybrid woven with dielectric loss silicon carbide fiber (SiC_f) to construct metastructural units compatible with large wavelengths, thereby extending the absorption performance towards the low-frequency regime. A genetic algorithm (GA) is integrated with full-wave simulations to optimize the fiber ratio, weaving pattern, and thickness of the hybrid woven metacomposite. Simulation results indicate that the optimized structure exhibits a reflection loss (RL) below −10 dB across the 4–15.6 GHz range, while experimental measurements confirm consistent broadband absorption from 4 to 12.5 GHz. The enhanced EMW absorption performance is attributed to the hybrid woven metacomposite, which facilitates deep wave penetration and efficient energy dissipation through synergistic impedance matching and multi-mechanism loss. Overall, this work presents a systematic strategy for developing low-frequency broadband structural microwave absorbers, with promising applications in electromagnetic shielding, radar stealth, and advanced electromagnetic protection.

Next-generation packaging materials are expected to have higher thermal conductivity, because the heat accumulated in high-performance electronic equipment should be removed to increase the service life of the equipment. At the same time, the dielectric loss of the material needs to be reduced to lessen signal delay and attenuation, especially for the applications under high frequency. In this work, we introduce nano-silicon carbide (SiC) and carbon nanotubes (CNTs) into the polystyrene (PS) and poly(methyl methacrylate) (PMMA) blends system. The design of two-way migration at the interface of CNTs and SiC nanoparticles is realized through the masterbatch method and processing technology control. As a result, the thermal conductivity is successfully increased up to 75%. Meanwhile, compared to the CNTs single-phase migration system, it effectively reduces the dielectric loss of the nanocomposite and optimizes the electrical insulation. This work has significant practical application value in the design of electronic device substrates and packaging materials, and provides an innovative methodology for the mesostructure design of multiphase nanocomposites.