Enhanced thermal conductivity and microwave dielectric properties by mesostructural design of multiphase nanocomposite

Next-generation packaging materials are expected to have higher thermal conductivity, because the heat accumulated in high-performance electronic equipment should be removed to increase the service life of the equipment. At the same time, the dielectric loss of the material needs to be reduced to lessen signal delay and attenuation, especially for the applications under high frequency. In this work, we introduce nano-silicon carbide (SiC) and carbon nanotubes (CNTs) into the polystyrene (PS) and poly(methyl methacrylate) (PMMA) blends system. The design of two-way migration at the interface of CNTs and SiC nanoparticles is realized through the masterbatch method and processing technology control. As a result, the thermal conductivity is successfully increased up to 75%. Meanwhile, compared to the CNTs single-phase migration system, it effectively reduces the dielectric loss of the nanocomposite and optimizes the electrical insulation. This work has significant practical application value in the design of electronic device substrates and packaging materials, and provides an innovative methodology for the mesostructure design of multiphase nanocomposites.