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One-dimensional metallic, magnetic, and dielectric nanomaterials-based composites for electromagnetic wave interference shielding
Nano Research 2022, 15 (10): 9595-9613
Published: 05 August 2022
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The excrescent electromagnetic (EM) radiation exposure in the air threatens human health and electronic equipment due to the abuse of EM waves in wireless telecommunication technology and electronic applications. Consequently, electromagnetic interference (EMI) shielding materials are provided to solve the EM waves pollution problem. In particular, the appearance of one-dimensional (1D) metallic, magnetic, and dielectric nanofillers will extremely reduce the density of EMI composite and enhance EMI protection performance because they can easily assemble to form complete two-dimensional (2D) or three-dimensional (3D) EMI network based on their high aspect ratio, large specific surface area, and additional attenuated sites. This review focuses on the EMI shielding composites with 1D metallic, magnetic, and dielectric nanofillers, which could be constructed in the final form of membrane- or aerogel/sponge-like shielding materials. According to the structural features, 1D metallic, magnetic, and dielectric nanofillers are classified into nanowires, nanorods, nanospindles, nanochains, nanofibers, nanotubes, nanorings, nanocoils, and quasi-one-dimensional (1D) van der Waals materials. Accordingly, the fabricated routes, shielding performances, and EM waves attenuation mechanism of the 1D metallic, magnetic, and dielectric nanofiller-based composites are summarized. It is found that the dominant shielding mechanism of most of the 1D metal-based EMI composites is reflection loss, while that of 1D magnetic and dielectric nanomaterials-based EMI composites is absorption loss caused by interfacial polarization, natural resonance, eddy current, and multiple scattering. Finally, the challenges and prospects of 1D nanofiller-based composites with a tunable architecture and composition are put forward, aiming to give a guideline for the next generation of high-performance EMI shielding materials.

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