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Review Article | Open Access

Toward brain-wide lifetime electrophysiology at single-cell single-spike resolution in mammals via implantable microelectronics

Hao Sheng Paul Le Floch Thomas S. Blum Jia Liu ( )
John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts 02134, USA
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Abstract

Technological advances in electrical sensing of the brain have driven major breakthroughs in neuroscience. The mammalian brain operates across extraordinary spatial and temporal scales, from single-neuron action potentials to brain-wide network dynamics that evolve over the lifespan. Capturing these processes therefore requires electrophysiological technologies capable of brain-wide, lifetime recording at single-cell and single-spike resolution. Implantable microelectronics offer a promising pathway toward this goal but face fundamental challenges in scalability, long-term biocompatibility, implantation, and data handling. In this review, we connect the multiscale nature of mammalian neural activity to the underlying engineering constraints of lifetime electrophysiology and synthesize emerging strategies spanning materials, microelectronics, implantation, data transmission and processing. Together, these advances define a conceptual and technological roadmap toward brain-wide, lifelong electrophysiology enabled by implantable microelectronics.

Graphical Abstract

Implantable microelectronics provide a pathway toward brain-wide, lifetime electrophysiology at single-cell and single-spike resolution in mammals. This review summarizes the technological requirements, key challenges, and recent advances in implantable microelectronics, and outlines a roadmap toward scalable and stable neural interfaces.

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Nano Research
Article number: 94908864

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Cite this article:
Sheng H, Floch PL, Blum TS, et al. Toward brain-wide lifetime electrophysiology at single-cell single-spike resolution in mammals via implantable microelectronics. Nano Research, 2026, 19(10): 94908864. https://doi.org/10.26599/NR.2026.94908864

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Received: 22 February 2026
Revised: 24 April 2026
Accepted: 22 May 2026
Published: 14 July 2026
© The Author(s) 2026. Published by Tsinghua University Press.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, https://creativecommons.org/licenses/by/4.0/).