The increasing performance demands of next-generation industrial and advanced specialized equipment are pushing traditional materials to their physical limits, posing a critical challenge in meeting stringent SWaP (size, weight, and power) requirements. This review addresses this challenge by focusing on the transformative potential of 2D (two-dimensional) materials. Leveraging their atomic thickness and quantum confinement effects, 2D materials offer unique advantages for next-generation technologies. We systematically review recent breakthroughs in applying 2D materials across key technological domains: stealth and electromagnetic interference shielding for enhanced survivability, high-performance sensing for superior perception, lightweight structures for improved protection, efficient energy systems for operational support, and quantum information technologies for advanced computational power. The intrinsic relationships and mechanisms connecting the unique microscopic properties of 2D materials to their macroscopic functional performance are then elucidated. Furthermore, we analyze the primary bottlenecks hindering the transition of 2D materials from laboratory research to practical engineering applications, including the wafer-scale synthesis of high-quality materials, the long-term operational stability in extreme environments, and the lack of standardized protocols for characterization and performance evaluation. Finally, considering AI (artificial intelligence)-driven materials design and van der Waals heterostructure fabrication techniques, we provide an outlook on future research directions by emphasizing the development of next-generation intelligent systems for specialized equipment through multifunctional integration and smart responsiveness of 2D materials and laying a theoretical foundation for securing a competitive edge in future frontiers.

In this review, research progress on 2D materials could be categorized into five major technological areas critical to advanced industrial applications.

First, in the domain of multi-band stealth and electromagnetic shielding, 2D materials such as graphene and two-dimensional transition metal carbides, nitrides, and carbonitrides (MXene) exhibit exceptional performance. Owing to their high electrical conductivity and large surface-to-volume ratios, these materials could effectively mitigate electromagnetic interference and manage thermal signatures. For example, MXene-based coatings achieved low infrared emissivity (~0.19), offering a distinct advantage for the long-term infrared stealth of strategic equipment operating in complex electromagnetic environments.

Second, in high-performance sensing and detection, 2D materials exploited their extreme interfacial sensitivity to surpass the detection limits of conventional devices. Field-effect transistor sensors based on transition metal dichalcogenides had achieved parts-per-billion level detection of hazardous chemical molecules. Moreover, their broad spectral response and ultra-fast carrier mobility enable high-performance optoelectronic detection, which was essential for high-speed laser communication, night vision, and target recognition in complex backgrounds.

Third, in lightweight structural protection and anti-corrosion, 2D materials offered extraordinary mechanical strength. Single-layer graphene, with a breaking strength of 130 GPa (over 200 times that of steel), could be integrated into composites to provide superior impact resistance while significantly reducing overall weight. Additionally, hexagonal boron nitride served as a robust barrier against high-temperature oxidation, remaining stable in air above 850 ℃ and thereby extending the service life of components dedicated for harsh environments.

Fourth, in the field of high-efficiency energy and power management, 2D materials bridged the gap between high energy density and high power output. By shortening ion diffusion pathways, 2D materials such as MXene and vertically stacked graphene enable rapid charge–discharge cycles in energy storage devices. In photovoltaic applications, 2D interlayers had been shown to enhance both the efficiency (up to 26%) and operational stability of solar cells under large deformation.

Fifth, in advanced computing and information security, 2D materials supportted the development of neuromorphic chips and secure communication systems. Memristors based on 2D heterostructures could endure temperatures up to 340 ℃ and exhibit high durability, providing a robust hardware foundation for integrating AI into autonomous industrial platforms.

2D materials—with their remarkable advantages including atomic-level thickness, quantum confinement effects, exceptional multi-physical properties, and high specific strength—have emerged as a pivotal platform for advancing frontier technologies. This review demonstrates that 2D materials have become indispensable strategic assets across five core domains, breaking the long-standing performance limits of traditional materials. In survivability, their combination of atomic thinness and high electrical conductivity enables broadband electromagnetic stealth for complex structural components, where conventional coatings are often too bulky or ineffective. In sensing, the extreme surface sensitivity of 2D interfaces facilitates real-time situational awareness and the capture of ultra-fast transients inherently beyond the reach of traditional semiconductors. In defensibility, their near-theoretical specific strength and impermeable atomic lattice offer a new paradigm for lightweight ballistic protection and long-term anti-corrosion in extreme environments. In supportability, 2D structures address the energy–power gap by providing optimized ion diffusion pathways for high-rate energy storage and conversion. Finally, in computing, the unique moiré physics and stable exciton states in 2D heterostructures present distinctive advantages for next-generation secure quantum information processing. Although laboratory-level proof-of-concepts have demonstrated transformative potential, the transition from "samples" to "products" and from "laboratory" to "engineering" remains constrained by three major challenges: (ⅰ) low-cost, large-scale fabrication; (ⅱ) long-term stability and reliability in extreme environments; and (ⅲ) the need for standardized testing and unified evaluation methods.

Future research should focus on three strategic directions: (ⅰ) systematic material screening and in-depth mechanism analysis to identify high-performance material systems and explore their intrinsic service behavior and failure mechanisms; (ⅱ) process innovation and technical optimization to develop green and high-throughput wafer-scale fabrication techniques, enhancing stability and compatibility with microelectronic processes; and (ⅲ) cross-disciplinary integration and intelligent design, combining theoretical insights with experimental validation to explore novel heterostructure architectures, twistronics, strain engineering, and the synergistic integration of AI and quantum computing.