The rapid development of microelectronic devices has driven a trend toward miniaturized and lightweight electronic devices with high heat flux. Porous structures are increasingly used in heat dissipation due to their ability to expand the heat transfer area, enhance nucleation sites for boiling, and regulate surface wettability, significantly improving boiling heat transfer. Microchannel heat dissipation technology based on porous structures has emerged as an effective and promising method to enhance heat sink performance. Recent advancements highlight three common configurations: porous structures on microchannel surfaces, porous materials within microchannels, and porous microchannel skeletons. These structures encompass coatings, microcavities, metal foams, porous fins, and ribs. This article reviews progress in microchannel heat dissipation using porous structures, evaluates the benefits and drawbacks of these configurations, addresses challenges such as balancing heat transfer and pressure drop, and proposes optimization strategies to overcome these issues.