Icing is widespread during aircraft flight and severely impairs aircraft performance. Small Unmanned Aerial Vehicles (UAVs) with weak anti-icing capabilities cannot allocate their limited energy to anti-icing and de-icing, making it difficult to equip them with traditional anti-icing and de-icing methods. Thus, there is an urgent need to develop new low-energy-consumption and high-efficiency anti-icing and de-icing technologies. An oblique jet Plasma Synthetic Jet Actuator (PSJA) was designed, and experimental research on its ice-breaking flow field and characteristics of non-adherent-ice-breaking was conducted. The results show that compared with the straight jet, the oblique jet achieves more efficient energy utilization and a larger effec-tive de-icing area. From the perspective of low energy consumption, experiments on removing adherent ice using a com-bined electric heating/oblique jet plasma synthetic jet actuator system were carried out. For 4 mm-thick adherent ice, the experiments demonstrated that the oblique jet plasma synthetic jet actuator can achieve residue-free removal of adherent ice after the electric heating device operates for 40 s, while the straight jet plasma synthetic jet actuator requires 80 s to achieve the same level of ice destruction. This verifies the low-energy-consumption advantage of the oblique jet plasma synthetic jet actuator compared to traditional electric heating and straight jet plasma synthetic jet actuator de-icing methods. By analyzing the evolution of the liquid film boundary between the ice and the substrate during the ice-breaking process of the plasma actuator, the mechanism of efficient adherent ice removal by the oblique jet plasma synthetic jet actuator was further revealed: the oblique jet creates a larger non-adhesive area, reducing the difficulty of breaking adherent ice and achieving effective de-icing. The above research can provide theoretical and practical references for low-energy-consumption ice removal of UAVs.
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With the advancement of near-space vehicle technology, a wide array of electronic equipment is increasingly being integrated into aircraft. However, the near-space environment presents unique challenges. The direct heat flow from outer space can significantly impact the performance of aircraft electronics. Additionally, as electronic equipment continues to evolve toward miniaturization and integration, the heat flux of electronic chips is escalating. Consequently, there is an urgent need for an efficient heat dissipation method to meet the cooling requirements of these electronic components.
The heat transfer performance of a dual synthetic jets actuator combined with a micron particle two-phase flow was studied. The steady-state and transient simulations were carried out using the single Euler model to analyze the temperature variation of the chip and the internal velocity variation of the flow field, and the influence of micrometer fluid parameters and micrometer particle types on the heat transfer capacity was deeply studied by using the control variable method.
The dual synthetic jets technology and microchannel technology with traditional liquid cooling methods was integrated. Building upon micron particle flow technology, this approach enhances the convective heat transfer and thermal conductivity of the fluid without significantly increasing the pressure drop in the channel. Additionally, it reduces the deposition of micron particles and improves fluid mixing. The interaction of the dual synthetic jets with the incoming flow further boosts the fluid's convective heat transfer capabilities.
The heat transfer performance of the dual synthetic jets actuator combined with micron two-phase flow particles improves as the concentration of micron fluid particles increases. The optimal heat transfer performance is achieved when the micron particle two-phase flow is composed of copper particles at a concentration of 8%. Upon activation of the dual synthetic jets driver, the chip temperature decreases from 328.225 K to 303.816 K, resulting in a 7.429% increase in heat transfer capacity. In comparison with pure water, the chip temperature is reduced by 1.007 K, and the heat transfer capacity is enhanced by 0.307%.
The heat transfer performance of micron two-phase flow particles varies depending on the type of micron particles and is positively correlated with the thermal conductivity of the metal particles. In this study, the concentrations of copper particles, copper oxide particles, and alumina particles were all set at 8%, and each demonstrated a certain cooling capability. Among these, copper particles exhibited the strongest heat transfer ability. Specifically, the temperature reduction achieved was 24.409 K, lowering the chip temperature from 55.075℃ to 30.666℃, which is close to the chip temperature under static non-working conditions. From the perspective of temperature reduction, this research holds significant potential for engineering applications.
When the dual synthetic jets actuator is combined with the micron particle two-phase flow, it significantly enhances fluid turbulence and molecular motion, leading to a substantial increase in convective heat transfer capacity. While changes in particle parameters do contribute to cooling, their effect is somewhat limited.
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