The rapid development of advanced engineering materials has pushed cutting operations into regimes characterized by extreme thermomechanical loads, revealing the limitations of conventional coated tool systems. To address these operational challenges, self-adaptive coating technologies have been developed to enable real-time modulation of performance under dynamic machining conditions. These coatings exhibit autonomous structural and functional responses to harsh working environments, thereby preserving cutting performance across a wide range of conditions. This review provides a critical assessment of self-adaptive coated cutting tools, focusing on two principal categories: self-organizing and self-lubricating systems. The preparation methods, cutting conditions, and degradation mechanisms of self-adaptive coatings are summarized and discussed. The respective advantages and limitations of each coating type are evaluated to inform their practical application and guide further development. Finally, a summary and outlook are presented to highlight future research directions in the field of self-adaptive coated cutting tools.

Diamond is a highly valuable material with diverse industrial applications, particularly in the fields of semiconductor, optics, and high-power electronics. However, its high hardness and chemical stability make it difficult to realize high-efficiency and ultra-low damage machining of diamond. To address these challenges, several polishing methods have been developed for both single crystal diamond (SCD) and polycrystalline diamond (PCD), including mechanical, chemical, laser, and ion beam processing methods. In this review, the characteristics and application scope of various polishing technologies for SCD and PCD are highlighted. Specifically, various energy beam-based direct and assisted polishing technologies, such as laser polishing, ion beam polishing, plasma-assisted polishing, and laser-assisted polishing, are summarized. The current research progress, material removal mechanism, and influencing factors of each polishing technology are analyzed. Although some of these methods can achieve high material removal rates or reduce surface roughness, no single method can meet all the requirements. Finally, the future development prospects and application directions of different polishing technologies are presented.