In integrated circuit (IC) manufacturing, fast, nondestructive, and precise detection of defects in patterned wafers, realized by bright-field microscopy, is one of the critical factors for ensuring the final performance and yields of chips. With the critical dimensions of IC nanostructures continuing to shrink, directly imaging or classifying deep-subwavelength defects by bright-field microscopy is challenging due to the well-known diffraction barrier, the weak scattering effect, and the faint correlation between the scattering cross-section and the defect morphology. Herein, we propose an optical far-field inspection method based on the form-birefringence scattering imaging of the defective nanostructure, which can identify and classify various defects without requiring optical super-resolution. The technique is built upon the principle of breaking the optical form birefringence of the original periodic nanostructures by the defect perturbation under the anisotropic illumination modes, such as the orthogonally polarized plane waves, then combined with the high-order difference of far-field images. We validated the feasibility and effectiveness of the proposed method in detecting deep subwavelength defects through rigid vector imaging modeling and optical detection experiments of various defective nanostructures based on polarization microscopy. On this basis, an intelligent classification algorithm for typical patterned defects based on a dual-channel AlexNet neural network has been proposed, stabilizing the classification accuracy of λ/16-sized defects with highly similar features at more than 90%. The strong classification capability of the two-channel network on typical patterned defects can be attributed to the high-order difference image and its transverse gradient being used as the network's input, which highlights the polarization modulation difference between different patterned defects more significantly than conventional bright-field microscopy results. This work will provide a new but easy-to-operate method for detecting and classifying deep-subwavelength defects in patterned wafers or photomasks, which thus endows current online inspection equipment with more missions in advanced IC manufacturing.

Multi-level programmable photonic integrated circuits (PICs) and optical metasurfaces have gained widespread attention in many fields, such as neuromorphic photonics, optical communications, and quantum information. In this paper, we propose pixelated programmable Si₃N₄ PICs with record-high 20-level intermediate states at 785 nm wavelength. Such flexibility in phase or amplitude modulation is achieved by a programmable Sb₂S₃ matrix, the footprint of whose elements can be as small as 1.2 μm, limited only by the optical diffraction limit of an in-house developed pulsed laser writing system. We believe our work lays the foundation for laser-writing ultra-high-level (20 levels and even more) programmable photonic systems and metasurfaces based on phase change materials, which could catalyze diverse applications such as programmable neuromorphic photonics, biosensing, optical computing, photonic quantum computing, and reconfigurable metasurfaces.

The growing demand for electronic devices, smart devices, and the Internet of Things constitutes the primary driving force for marching down the path of decreased critical dimension and increased circuit intricacy of integrated circuits. However, as sub-10 nm high-volume manufacturing is becoming the mainstream, there is greater awareness that defects introduced by original equipment manufacturer components impact yield and manufacturing costs. The identification, positioning, and classification of these defects, including random particles and systematic defects, are becoming more and more challenging at the 10 nm node and beyond. Very recently, the combination of conventional optical defect inspection with emerging techniques such as nanophotonics, optical vortices, computational imaging, quantitative phase imaging, and deep learning is giving the field a new possibility. Hence, it is extremely necessary to make a thorough review for disclosing new perspectives and exciting trends, on the foundation of former great reviews in the field of defect inspection methods. In this article, we give a comprehensive review of the emerging topics in the past decade with a focus on three specific areas: (a) the defect detectability evaluation, (b) the diverse optical inspection systems, and (c) the post-processing algorithms. We hope, this work can be of importance to both new entrants in the field and people who are seeking to use it in interdisciplinary work.