Publications
Sort:
Open Access Issue
Numerical Simulation of Elastocaloric Cooling Thermal Control System for Electronic Chips
Journal of Refrigeration 2024, 45(4): 85-92
Published: 16 August 2024
Abstract PDF (5.1 MB) Collect
Downloads:0

The rapid development of the electronic industry has led to a sharp increase in the heat flux of electronic equipment. The search for efficient cooling methods can significantly reduce the operating temperature of devices, improve their performance, and extend their lifespan. To further reduce the maximum operating temperature of chips, this study proposes a thermal control method for an electronic chip using the elastocaloric effect in shape memory alloys. The cold energy generated during unloading was transferred through the fluid to the microchannel heat sink thermal control system of the electronic chip with good heat dissipation performance. The temperature variation characteristics of the system under three-dimensional conditions were analyzed using FLUENT software. The results showed that the heat transfer fluid after refrigeration could reduce the highest temperature of the chip by 5.5 K, and the performance of the microchannel heat sink was improved by approximately 10.7%. Parametric analysis shows that an increase in the cycle frequency and accumulated flow rate of cooling liquid can significantly improve the cooling capacity of the refrigeration system, with cycle frequencies of 0.25 Hz and 0.33 Hz improving the cooling power by 68% and 92%, respectively.

Open Access Research Article Issue
Prediction of electrical contact endurance subject to micro-slip wear using friction energy dissipation approach
Friction 2019, 7(6): 537-550
Published: 06 November 2018
Abstract PDF (15 MB) Collect
Downloads:79

Fretting wear is a common cause of failure of an electrical contact (EC). In this study, we analyzed in detail the failure of EC induced especially by sliding using the representative electrical terminals. Furthermore, combining the friction energy dissipation theory, we proposed a prediction model to evaluate the electrical connector endurance (ECE) based on the contact stress and geometrical changes during the wear process obtained from a numerical model. The study helps establish that the friction energy dissipation theory is a powerful tool to analyze a contact failure due to wear. The proposed model proves to be effective in predicting the ECE for all considered cases such as micro-slip amplitude, contact force, overturning angle, superficial layer thickness, and friction/wear coefficients.

Total 2