Dear Colleagues,
The building sector consumes approximately 40% of global energy and releases about one-third of total greenhouse gases every year. With the appeal of “Carbon Neutral” goal, there is an urgent demand to develop high-performance buildings with lower direct and indirect carbon emissions. For this purpose, there is an increasing research interest on the advanced materials for high-performance building envelopes, aiming to contribute more to the reduction of greenhouse gas emissions and improve the energy flexibility of buildings while maintaining high quality of indoor environment.
As it is known, building envelope represents in fact an integrated system able to influence the flows of energy in two main traditional ways. Thermal properties such as thermal conductivity, thermal diffusivity, etc. affect the convective and conductive heat transfer of buildings; optical properties such as reflectivity, transmittance and emittance affect the radiative heat transfer between the building and the environment, including solar short-wave radiation and long-wave radiation.
In recent decades, high-performance envelope materials are developed to regulate the thermal environment in buildings for reducing HVAC system energy consumption without compromising thermal comfort. Broadly speaking, there are mainly three kinds of high-performance envelope materials, namely thermal insulation materials, glazing materials or coatings, and radiative cooling materials, and they are becoming increasingly popular for energy savings and deterrence of the worldwide energy crisis, also contributing towards “Net Zero” and “Carbon Neutral”.
The purpose of this special issue is therefore to present scientific articles that document the recent development and advancement of high-performance envelope materials for building envelops, with a particular focus on techniques, calculation and performance simulation. This special issue mainly covers original research studies, including, but not limited to the following topics:
Papers selected for this topical issue are subject to a rigorous peer review procedure before being rapidly and widely disseminated.
We sincerely invite you to submit your original work to this special issue and are looking forward to sharing your outstanding research outcomes with the peers around the world.
Paper submissions: When preparing your manuscript, please follow the Instructions for Authors of Building Simulation, which can be downloaded from the journal website (www.springer.com/journal/12273).
Submit your paper online at www.editorialmanager.com/buil and mark “Special issue on High-Performance Envelope Materials for Low-Carbon Buildings” in your manuscript.
Important Dates:
Co-guest Editors:
Peng Xue, Beijing University of Technology, China
E-mail: xp@bjut.edu.cn
Rongpeng Zhang, Hunan University, China
E-mail: zhangrongpeng@hnu.edu.cn
Yuanda Cheng, Taiyuan University of Technology, China
E-mail: chengyuanda@tyut.edu.cn
Editorial Office
www.springer.com/journal/12273
E-mail: bsjournal@tsinghua.edu.cn
Articles & Issues
FEEDBACK 
TOP