Numerical Simulation of Elastocaloric Cooling Thermal Control System for Electronic Chips

The rapid development of the electronic industry has led to a sharp increase in the heat flux of electronic equipment. The search for efficient cooling methods can significantly reduce the operating temperature of devices, improve their performance, and extend their lifespan. To further reduce the maximum operating temperature of chips, this study proposes a thermal control method for an electronic chip using the elastocaloric effect in shape memory alloys. The cold energy generated during unloading was transferred through the fluid to the microchannel heat sink thermal control system of the electronic chip with good heat dissipation performance. The temperature variation characteristics of the system under three-dimensional conditions were analyzed using FLUENT software. The results showed that the heat transfer fluid after refrigeration could reduce the highest temperature of the chip by 5.5 K, and the performance of the microchannel heat sink was improved by approximately 10.7%. Parametric analysis shows that an increase in the cycle frequency and accumulated flow rate of cooling liquid can significantly improve the cooling capacity of the refrigeration system, with cycle frequencies of 0.25 Hz and 0.33 Hz improving the cooling power by 68% and 92%, respectively.