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Research Article | Open Access | Just Accepted

Laser direct patterning of two-dimensional MoS2 for photoelectric sensing arrays

Long Chen1( )Yi Wang2Xiaobo Liao1Xuan Liao1Lingyu Zang3Jinhui Song2( )

1 School of Manufacturing Science and Engineering, Southwest University of Science and Technology, Mianyang, China

2 School of Mechanical Engineering, Dalian University of Technology, Dalian, China

3 Product Development Department, Mianyang Xinchen Engine Co., LTD., Mianyang, China

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Abstract

Two-dimensional MoS2 photoelectric sensing array has shown great application potential in the image sensing field, and the fabrication of the pattern structure is the foundation for the construction of MoS2 array devices. However, the traditional ion etching patterning technology easily leads to the shedding and residue of MoS2 materials, which affects the quality of the pattern structure and the performance of the devices. Here, through a simple laser direct patterning method, we investigate the etching-free fabrication of the two-dimensional MoS2 pattern structure and the construction of the photoelectric sensing array. The research results show that for monolayer MoS2 materials, the removal rate of the laser direct patterning method can reach about 98%, the structural density of the fabricated array pattern can reach 107 units/mm2, and the size of each pattern unit is about 3.5μm. Moreover, this fabrication method rarely introduces ion trap defects, and the photoelectric response of the MoS2 sensing array has no obvious trailing effect. This work provides a reference for high-quality patterning of two-dimensional materials into array devices without etching.

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Cite this article:
Chen L, Wang Y, Liao X, et al. Laser direct patterning of two-dimensional MoS2 for photoelectric sensing arrays. Nano Research, 2026, https://doi.org/10.26599/NR.2026.94909164
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Received: 30 June 2026
Revised: 23 August 2026
Accepted: 02 September 2026
Available online: 02 September 2026

© The Author(s) 2026. Published by Tsinghua University Press.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, https://creativecommons.org/licenses/by/4.0/)