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Research Article | Open Access

A robust anti-thermal quenching red phosphors: Cs2ZrCl6:Sb3+

Haoyi Zhang§Jingtao Jia§Baowei Zhang( )Siyu Lu ( )
College of Chemistry, Zhengzhou University, Zhengzhou 450001, China

§ Haoyi Zhang and Jingtao Jia contributed equally to this work.

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Abstract

Most of phosphors undergo thermal quenching (TQ) at high temperature, due to thermal-activated non-radiative transitions. TQ effects lead to significant reduced luminous efficiency of phosphors at high operation temperature, hindering their application in high power phosphor-converted white light-emitting diodes (WLED). Here, we report a zero-dimensional metal halide perovskite: Cs2ZrCl6:Sb3+, exhibiting robust anti-TQ red emission up to 500 K, comparable to the mainstream anti-TQ phosphors (e.g. K2SiF6:Mn4+). The hetero-valent doping of Sb3+ induces structure defects of host and thus compensate the non-radiative emission loss through thermal accelerated energy transfer from defects to emitter at high temperature. We assembled the red anti-TQ phosphor into a white light-emitting diode (WLED) device, achieving stable output light intensity and chromaticity up to 2000 mA.

Graphical Abstract

This study develops a zero-dimensional metal halide perovskite: Cs2ZrCl6:Sb3+, exhibiting robust anti-thermal quenching (TQ) red emission up to 500 K. The hetero-valent doping induces high concentration of defects in host lattice through thermal-activated energy transfer from defects to emitter. Cs2ZrCl6:Sb3+ phosphors were combined with the ultraviolet (UV) light-emitting diode (LED) chip and another green anti-TQ phosphor ((Rb3InCl6:xSb3+) into the high-power white light-emitting diode (WLED).

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Nano Research
Article number: 94908432

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Cite this article:
Zhang H, Jia J, Zhang B, et al. A robust anti-thermal quenching red phosphors: Cs2ZrCl6:Sb3+. Nano Research, 2026, 19(3): 94908432. https://doi.org/10.26599/NR.2026.94908432
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Received: 16 November 2025
Revised: 30 December 2025
Accepted: 12 January 2026
Published: 04 March 2026
© The Author(s) 2026. Published by Tsinghua University Press.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, https://creativecommons.org/licenses/by/4.0/).