AI Chat Paper
Note: Please note that the following content is generated by AMiner AI. SciOpen does not take any responsibility related to this content.
{{lang === 'zh_CN' ? '文章概述' : 'Summary'}}
{{lang === 'en_US' ? '中' : 'Eng'}}
Chat more with AI
PDF (10 MB)
Collect
Submit Manuscript AI Chat Paper
Show Outline
Outline
Show full outline
Hide outline
Outline
Show full outline
Hide outline
Research Article | Open Access

High-sensitivity piezoelectric response enabled by heterogeneous stress–electric field distribution in 3D interconnected porous ceramics

Xiaoying Feng1Jie Xu1( )Kena Zhang2Chenhe Xia3Xin Gao4Mupeng Zheng4 ( )Yudong Hou4Feng Gao1( )Shujun Zhang5( )
State Key Laboratory of Solidification Processing, MIIT Key Laboratory of Radiation Detection Materials and Devices, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Department of Materials Science and Engineering, The Pennsylvania State University, PA 16802, USA
National Elite Institute of Engineering, Northwestern Polytechnical University, Xi’an 710072, China
Key Laboratory of Advanced Functional Materials, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
Department of Chemistry, City University of Hong Kong, Hong Kong 999077, China
Show Author Information

Abstract

Porous piezoceramics are attractive for high-sensitivity sensing and energy conversion due to their low density, reduced dielectric constant (εr), and good mechanical compliance. However, increasing porosity is often accompanied by a significant reduction in the piezoelectric charge coefficient (d33), creating an intrinsic trade-off that limits the practical use of porous structures in high-sensitivity piezoelectric devices and leaves their overall performance advantages under debate. In this work, we overcome this challenge by developing a fully open-cell, three-dimensionally interconnected Pb(Zr1/2Ti1/2)O3–Pb(Zn1/3Nb2/3)O3–Pb(Ni1/3Nb2/3)O3 (PZT–PZN–PNN, PZNNT) porous piezoceramic (3D-PPC). Despite an ultrahigh porosity of 92%, the material maintains a high d33 of approximately 470 pC/N, approximately 90% of that of the dense ceramic. The effective εr is reduced to approximately 140 (a 94% decrease), leading to an approximately 14-fold enhancement in the piezoelectric voltage coefficient g33 (approximately 380×10−3 Vm/N). Combined microstructural characterization, domain analysis, defect studies, and multiphysics simulations show that the exceptional performance arises from synergistic effects of heterogeneous stress and electric fields, multiscale domain structures, and defect-mediated regulation within the three-dimensionally interconnected porous architecture. Finally, the material generates peak output voltages up to 200 V under subtle mechanical excitation and achieves an ultrahigh sensitivity of 38.7 V/kPa. These results show that three-dimensionally interconnected porous architectures are not merely passive means of reducing dielectric permittivity but also active structural strategies for tuning local fields and polarization behavior.

Graphical Abstract

Electronic Supplementary Material

Download File(s)
JAC1280_ESM.pdf (944.5 KB)

References

【1】
【1】
 
 
Journal of Advanced Ceramics
Article number: 9221280

{{item.num}}

Comments on this article

Go to comment

< Back to all reports

Review Status: {{reviewData.commendedNum}} Commended , {{reviewData.revisionRequiredNum}} Revision Required , {{reviewData.notCommendedNum}} Not Commended Under Peer Review

Review Comment

Close
Close
Cite this article:
Feng X, Xu J, Zhang K, et al. High-sensitivity piezoelectric response enabled by heterogeneous stress–electric field distribution in 3D interconnected porous ceramics. Journal of Advanced Ceramics, 2026, 15(5): 9221280. https://doi.org/10.26599/JAC.2026.9221280

1033

Views

233

Downloads

1

Crossref

0

Web of Science

0

Scopus

0

CSCD

Received: 19 December 2025
Revised: 10 March 2026
Accepted: 10 March 2026
Published: 13 May 2026
© The Author(s) 2026.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, http://creativecommons.org/licenses/by/4.0/).