Enhanced heat transfer research by combining dual synthetic jets actuator with different metal-water micron fluids

With the advancement of near-space vehicle technology, a wide array of electronic equipment is increasingly being integrated into aircraft. However, the near-space environment presents unique challenges. The direct heat flow from outer space can significantly impact the performance of aircraft electronics. Additionally, as electronic equipment continues to evolve toward miniaturization and integration, the heat flux of electronic chips is escalating. Consequently, there is an urgent need for an efficient heat dissipation method to meet the cooling requirements of these electronic components.

The heat transfer performance of a dual synthetic jets actuator combined with a micron particle two-phase flow was studied. The steady-state and transient simulations were carried out using the single Euler model to analyze the temperature variation of the chip and the internal velocity variation of the flow field, and the influence of micrometer fluid parameters and micrometer particle types on the heat transfer capacity was deeply studied by using the control variable method.

The dual synthetic jets technology and microchannel technology with traditional liquid cooling methods was integrated. Building upon micron particle flow technology, this approach enhances the convective heat transfer and thermal conductivity of the fluid without significantly increasing the pressure drop in the channel. Additionally, it reduces the deposition of micron particles and improves fluid mixing. The interaction of the dual synthetic jets with the incoming flow further boosts the fluid's convective heat transfer capabilities.

The heat transfer performance of the dual synthetic jets actuator combined with micron two-phase flow particles improves as the concentration of micron fluid particles increases. The optimal heat transfer performance is achieved when the micron particle two-phase flow is composed of copper particles at a concentration of 8%. Upon activation of the dual synthetic jets driver, the chip temperature decreases from 328.225 K to 303.816 K, resulting in a 7.429% increase in heat transfer capacity. In comparison with pure water, the chip temperature is reduced by 1.007 K, and the heat transfer capacity is enhanced by 0.307%.

The heat transfer performance of micron two-phase flow particles varies depending on the type of micron particles and is positively correlated with the thermal conductivity of the metal particles. In this study, the concentrations of copper particles, copper oxide particles, and alumina particles were all set at 8%, and each demonstrated a certain cooling capability. Among these, copper particles exhibited the strongest heat transfer ability. Specifically, the temperature reduction achieved was 24.409 K, lowering the chip temperature from 55.075℃ to 30.666℃, which is close to the chip temperature under static non-working conditions. From the perspective of temperature reduction, this research holds significant potential for engineering applications.

When the dual synthetic jets actuator is combined with the micron particle two-phase flow, it significantly enhances fluid turbulence and molecular motion, leading to a substantial increase in convective heat transfer capacity. While changes in particle parameters do contribute to cooling, their effect is somewhat limited.