Temperature field model in surface grinding: a comparative assessment

Grinding is a crucial process in machining workpieces because it plays a vital role in achieving the desired precision and surface quality. However, a significant technical challenge in grinding is the potential increase in temperature due to high specific energy, which can lead to surface thermal damage. Therefore, ensuring control over the surface integrity of workpieces during grinding becomes a critical concern. This necessitates the development of temperature field models that consider various parameters, such as workpiece materials, grinding wheels, grinding parameters, cooling methods, and media, to guide industrial production. This study thoroughly analyzes and summarizes grinding temperature field models. First, the theory of the grinding temperature field is investigated, classifying it into traditional models based on a continuous belt heat source and those based on a discrete heat source, depending on whether the heat source is uniform and continuous. Through this examination, a more accurate grinding temperature model that closely aligns with practical grinding conditions is derived. Subsequently, various grinding thermal models are summarized, including models for the heat source distribution, energy distribution proportional coefficient, and convective heat transfer coefficient. Through comprehensive research, the most widely recognized, utilized, and accurate model for each category is identified. The application of these grinding thermal models is reviewed, shedding light on the governing laws that dictate the influence of the heat source distribution, heat distribution, and convective heat transfer in the grinding arc zone on the grinding temperature field. Finally, considering the current issues in the field of grinding temperature, potential future research directions are proposed. The aim of this study is to provide theoretical guidance and technical support for predicting workpiece temperature and improving surface integrity.