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Friction 2020, 8(2): 323-334 https://doi.org/10.1007/s40544-019-0258-6
Research Article | Open Access | Issue | Published: 02 March 2019

Surface removal of a copper thin film in an ultrathin water environment by a molecular dynamics study

Show Author's Information Junqin SHI1,  Liang FANG1,2( ),  Kun SUN1( ),  Weixiang PENG1,  Juan GHEN1,  Meng ZHANG1
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
School of Mechanical and Electrical Engineering, Xiamen University Tan KahKee College, Zhangzhou 363105, China
Keywords:
surface removal, monoatomic adhesion, copper thin film, ultrathin water film
Cite this article:
SHI J, FANG L, SUN K, et al. Surface removal of a copper thin film in an ultrathin water environment by a molecular dynamics study. Friction, 2020, 8(2): 323-334. https://doi.org/10.1007/s40544-019-0258-6
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Abstract Full text Electronic supplementary material About this article

The surface planarity and asperity removal behavior on atomic scale in an ultrathin water environment were studied for a nanoscale process by molecular dynamics simulation. Monolayer atomic removal is achieved under both noncontact and monoatomic layer contact conditions with different water film thicknesses. The newly formed surface is relatively smooth without deformed layers, and no plastic defects are present in the subsurface. The nanoscale processing is governed by the interatomic adhering action during which the water film transmits the loading forces to the Cu surface and thereby results in the migration and removal of the surface atoms. When the scratching depth ≥ 0.5 nm, the abrasive particle squeezes out the water film from the scratching region and scratches the Cu surface directly. This leads to the formation of trenches and ridges, accumulation of chips ahead of the particles, and generation of dislocations within the Cu substrate. This process is mainly governed by the plowing action, leading to the deterioration of the surface quality. This study makes the "0 nm planarity, 0 residual defects, and 0 polishing pressure" in a nanoscale process more achievable and is helpful in understanding the nanoscale removal of materials for developing an ultra-precision manufacture technology.


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Electronic supplementary material
About this article

Surface removal of a copper thin film in an ultrathin water environment by a molecular dynamics study

Show Author's information Junqin SHI1, Liang FANG1,2( ), Kun SUN1( ), Weixiang PENG1, Juan GHEN1, Meng ZHANG1
State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
School of Mechanical and Electrical Engineering, Xiamen University Tan KahKee College, Zhangzhou 363105, China

Abstract

The surface planarity and asperity removal behavior on atomic scale in an ultrathin water environment were studied for a nanoscale process by molecular dynamics simulation. Monolayer atomic removal is achieved under both noncontact and monoatomic layer contact conditions with different water film thicknesses. The newly formed surface is relatively smooth without deformed layers, and no plastic defects are present in the subsurface. The nanoscale processing is governed by the interatomic adhering action during which the water film transmits the loading forces to the Cu surface and thereby results in the migration and removal of the surface atoms. When the scratching depth ≥ 0.5 nm, the abrasive particle squeezes out the water film from the scratching region and scratches the Cu surface directly. This leads to the formation of trenches and ridges, accumulation of chips ahead of the particles, and generation of dislocations within the Cu substrate. This process is mainly governed by the plowing action, leading to the deterioration of the surface quality. This study makes the "0 nm planarity, 0 residual defects, and 0 polishing pressure" in a nanoscale process more achievable and is helpful in understanding the nanoscale removal of materials for developing an ultra-precision manufacture technology.

Keywords: surface removal, monoatomic adhesion, copper thin film, ultrathin water film

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Publication history

Received: 16 August 2018
Revised: 31 October 2018
Accepted: 19 November 2018
Published: 02 March 2019
Issue date: April 2020

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© The author(s) 2019

Acknowledgements

This work was supported by the National Natural Science Foundation of China [Grant numbers 51375364 and 51475359] and Natural Science Foundation of Shaanxi Province of China [2014JM6219].

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