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Research Article

Ultrafast shape change and joining of small-volume materials using nanoscale electrical discharge

Cheng-Cai Wang1,5Qing-Jie Li1,4Liang Chen1,2Yong-Hong Cheng2Jun Sun1Zhi-Wei Shan1( )Ju Li1,3 ( )Evan Ma1,4( )
Center for Advancing Materials Performance from the Nanoscale (CAMP-Nano) & Hysitron Applied Research Center in China (HARCC)State Key Laboratory for Mechanical Behavior of MaterialsXi'an Jiaotong UniversityXi'an710049China
State Key Laboratory of Electrical Insulation and Power EquipmentXi'an Jiaotong UniversityXi'an710049China
Department of Nuclear Science and Engineering and Department of Materials Science and EngineeringMassachusetts Institute of Technology77 Massachusetts AvenueCambridgeMassachusetts02139USA
Department of Materials Science and EngineeringJohns Hopkins UniversityBaltimoreMaryland21218USA
SJS Limited101 Xihuan RoadJingzhouHubei434024China
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Abstract

Using nanoscale electrical-discharge-induced rapid Joule heating, we developed a method for ultrafast shape change and joining of small-volume materials. Shape change is dominated by surface-tension-driven convection in the transient liquid melt, giving an extremely high strain rate of ~106 s–1. In addition, the heat can be dissipated in small volumes within a few microseconds through thermal conduction, quenching the melt back to the solid state with cooling rates up to 108 K·s-1. We demonstrate that this approach can be utilized for the ultrafast welding of small-volume crystalline Mo (a refractory metal) and amorphous Cu49Zr51 without introducing obvious microstructural changes, distinguishing the process from bulk welding.

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Nano Research
Pages 2143-2151

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Cite this article:
Wang C-C, Li Q-J, Chen L, et al. Ultrafast shape change and joining of small-volume materials using nanoscale electrical discharge. Nano Research, 2015, 8(7): 2143-2151. https://doi.org/10.1007/s12274-014-0685-7

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Received: 29 September 2014
Revised: 30 November 2014
Accepted: 07 December 2014
Published: 17 July 2015
© Tsinghua University Press and Springer‐Verlag Berlin Heidelberg 2015