Optimization of data center thermal management performance under failure mode of rack-level heat pipe backplane system

To address localized hotspot issues arising from traditional cooling methods in high-power-density data centers and to ensure a stable thermal environment, this study developed a numerical model of a rack equipped with a heat pipe backplane, validated through experimental data. The study evaluated the thermal management performance and fault tolerance of the heat pipe backplane system for data centers under different load rates (60%, 100%) and failure modes (single rack, multiple racks). Results indicate that under a 60% load rate, the rack inlet temperature remained stable between 23.4 and 25.1 ℃, while server outlet temperatures ranged from 27.3 to 32.1 ℃. In the event of a single rack fan group failure, increasing the airflow of adjacent fans by 60% reduced the average rack outlet temperature to below 26.4 ℃. For multiple rack backplane system failures, maintaining appropriate spacing between failed racks kept the overall room temperature below 27 ℃, thereby preventing localized hotspots. However, simultaneous failures of adjacent racks increased the maximum inlet temperature to 27.4 ℃, heightening hotspot risks. These findings demonstrate that heat pipe backplane systems offer significant advantages in optimizing internal rack airflow organization, mitigating hotspot risks, and enhancing fault tolerance, thereby providing crucial theoretical support for the design and optimization of thermal management strategies in data center environments.