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Publishing Language: Chinese

Intelligent optimization design of composite microchannel liquid cold plate for airborne electronic devices

Tongyong ZHANG1,2Mengxiang ZENG1,2Qiang CHEN1,2Qingguo FEI1,2Dahai ZHANG1,2( )
Key Laboratory of Structure and Thermal Protection of High Speed Aircraft, Ministry of Education, Southeast University, Nanjing 211189, China
School of Mechanical Engineering, Southeast University, Nanjing 211189, China
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Abstract

With the improvements in performance and integration of onboard electronics, traditional microchannel heat sinks (MCHs) are inadequate for the escalating thermal management requirements. A surrogate model for MCH with turbulence-promoting structures is established based on neural network. Combined with the NSGA-Ⅱ algorithm, the surrogate is employed to conduct multi-objective optimization. The primary factors governing thermal-hydraulic performance are identified by SHAP analysis. Additionally, the optimal nondimensional design parameters are obtained based on entropy-weighted TOPSIS. The results indicate that the neural network fully learns the complex mapping between features and performance, achieving good fitting and predictive ability, with a maximum mean absolute error of 0.383. The surrogate accelerates optimization process, with a maximum error of 6.34%. Compared with the original design, the optimized MCH achieves an average Nusselt number of 70.755 and an overall performance factor (PEC) of 2.223, yielding enhancements of 36.7% in heat transfer and 9.2% in comprehensive performance.

CLC number: V245.3 Document code: A Article ID: 1000-6893(2026)13-533030-18

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Acta Aeronautica et Astronautica Sinica

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Cite this article:
ZHANG T, ZENG M, CHEN Q, et al. Intelligent optimization design of composite microchannel liquid cold plate for airborne electronic devices. Acta Aeronautica et Astronautica Sinica, 2026, 47(13). https://doi.org/10.7527/S1000-6893.2026.33030

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Received: 03 November 2025
Revised: 28 November 2025
Accepted: 02 February 2026
Published: 10 February 2026
© 2026 The Journal of Acta Aeronautica et Astronautica Sinica