AI Chat Paper
Note: Please note that the following content is generated by AMiner AI. SciOpen does not take any responsibility related to this content.
{{lang === 'zh_CN' ? '文章概述' : 'Summary'}}
{{lang === 'en_US' ? '中' : 'Eng'}}
Chat more with AI
PDF (4.2 MB)
Collect
Submit Manuscript AI Chat Paper
Show Outline
Outline
Show full outline
Hide outline
Outline
Show full outline
Hide outline
Publishing Language: Chinese

Random load identification method and verification in thermal environment based on Tikhonov regularization

Ye YUAN1,2Qixiao ZHU1,2Rui ZHU1,2Xiaochen HANG3Pan LI1,2Qingguo FEI1,2( )
College of Mechanical and Electronic Engineering, Southeast University, Nanjing 211189, China
Key Laboratory of Structures and Thermal Protection for High-Speed Vehicles, Ministry of Education, Nanjing 211189, China
School of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China
Show Author Information

Abstract

To address the engineering challenge of reduced accuracy in dynamic load identification in the thermal-vibration coupled environment of high-speed vehicle due to environmental interference, this study establishes a test platform for random load identification that considers thermal-vibration coupling effects. This platform integrates a shaker and a quartz lamp array to achieve precise application of random and thermal loads, respectively, and combines high-temperature accelerometers to measure dynamic responses under ground-based thermal conditions. To account for temperature effects, a random load identification method in thermal environments based on Tikhonov regularization is proposed. By incorporating model corrections that consider thermal effects and introducing a frequency response function deformation matrix into Tikhonov regularization to account for the application conditions of random loads, the method is used to perform inversion analysis on structural dynamic response data. Finally, comparative experiments were conducted under normal temperature (20 ℃) and high temperature (500 ℃) conditions. The results indicate that the platform can effectively simulate the thermal-vibration coupled test conditions of an aircraft and meet the requirements of load inversion in thermal-vibration coupling states. Based on load inversion results, it is concluded that the effects of thermal environment on structural parameters and thermal disturbance noise are key factors affecting load identification accuracy, providing a theoretical foundation and experimental support for the development of random load identification technology in complex thermal-vibration coupled environments.

CLC number: V216.2+1;V216.5+7 Document code: A Article ID: 1000-6893(2026)11-232325-11

References

【1】
【1】
 
 
Acta Aeronautica et Astronautica Sinica

{{item.num}}

Comments on this article

Go to comment

< Back to all reports

Review Status: {{reviewData.commendedNum}} Commended , {{reviewData.revisionRequiredNum}} Revision Required , {{reviewData.notCommendedNum}} Not Commended Under Peer Review

Review Comment

Close
Close
Cite this article:
YUAN Y, ZHU Q, ZHU R, et al. Random load identification method and verification in thermal environment based on Tikhonov regularization. Acta Aeronautica et Astronautica Sinica, 2026, 47(11). https://doi.org/10.7527/S1000-6893.2025.32325

0

Views

0

Downloads

0

Crossref

0

Scopus

0

CSCD

Received: 30 May 2025
Revised: 11 August 2025
Accepted: 23 September 2025
Published: 03 November 2025
© 2026 The Journal of Acta Aeronautica et Astronautica Sinica