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Open Access

Design and preparation of a high immunity piezoresistive pressure sensor

Mengxuan TANGXu ZHANGCheng LEI( )Yuqiao LIUPengfei JILei FANQiulin TANTing LIANG
State key Laboratory of Extreme Environment Optoelectronic Dynamic Measurement Technology and Instrument, North University of China, Taiyuan 030051, China
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Abstract

To eliminate the complex interference encountered by pressure sensors in practical applications, we designed and fabricated a piezoresistive pressure sensor featuring wide-temperature-range adaptability to harsh environments and high anti-interference characteristics. A circuit integrating conditioning compensation function with signal conversion function was proposed to compensate and convert pressure signals, and an integrated encapsulated housing was designed and fabricated to connect the pressure sensor chip with the PCB circuit for real-time processing of pressure signals. Its anti-interference performance was primarily reflected in reducing interference to the sensor caused by environmental temperature, voltage noise, and long-distance transmission. The thermal zero drift of the pressure sensor was reduced by 88.95%, and thermal sensitivity drift by 76.17% across the temperature range from −40 ℃ to 105 ℃. When subjected to voltage noise, the signal fluctuation was reduced by 99.7% after circuit processing. When subjected to long-distance transmission, the signal degradation after circuit processing was reduced by 89.9%. The results show that the sensor’s anti-interference performance in complex real-world applications has been enhanced, resulting in more reliable output of the sensor.

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Journal of Measurement Science and Instrumentation
Pages 125-132

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Cite this article:
TANG M, ZHANG X, LEI C, et al. Design and preparation of a high immunity piezoresistive pressure sensor. Journal of Measurement Science and Instrumentation, 2026, 17(1): 125-132. https://doi.org/10.62756/jmsi.1674-8042.2026010

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Received: 15 September 2025
Revised: 24 October 2025
Accepted: 27 October 2025
Published: 01 March 2026
© The Author(s) 2026.

The articles published in this open access journal are distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits use, distribution and reproduction in any medium, provided the original work is properly cited.