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Publishing Language: Chinese | Open Access

Experiment and Simulation of Semiconductor Refrigeration Device for Air-cooled Garment

Zheming Cheng1,2Bin Li1Xinping Ouyang1( )Bowen Su1
School of Energy and Power Engineering, University of Shanghai for Science and Technology, Shanghai, 200093, China
Zhoukou Normal University, Zhoukou, 466001, China
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Abstract

Air-cooled garments are designed and the cooling capacity, state parameters, and flow rates of the air inlet and outlet are determined. The refrigeration capacity required by the cooling device matching that of the garment is calculated. Experimental and numerical simulations of a thermoelectric refrigeration device are conducted. The accuracy of the simulation results is verified by comparing the experimental data with the simulation results. An optimization scheme for refrigeration devices is proposed. The thermoelectric refrigeration device is optimized by validated numerical simulation calculation models, which can provide 6.283×10-3 m3/s of cold air at 29 ℃ for a garment under the dry bulb temperature of 34.4 ℃ and wet bulb temperature of 27.9 ℃, and the device can meet the design requirements of the air-cooled garment.

CLC number: TB66; TN37 Document code: A Article ID: 0253-4339(2024)02-0152-08

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Journal of Refrigeration
Pages 152-159

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Cite this article:
Cheng Z, Li B, Ouyang X, et al. Experiment and Simulation of Semiconductor Refrigeration Device for Air-cooled Garment. Journal of Refrigeration, 2024, 45(2): 152-159. https://doi.org/10.3969/j.issn.0253-4339.2024.02.152

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Received: 06 February 2023
Revised: 28 July 2023
Accepted: 31 July 2023
Published: 16 April 2024
© 2024 The Editorial Office of Journal of Refrigeration

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, http://creativecommons.org/licenses/by/4.0/).