Compact EBG structure for ground bounce noise suppression in high-speed digital systems

This paper proposes Inductive Enhanced-Electromagnetic Bandgap (IE-EBG) structure to suppress the Ground Bounce Noise (GBN) for high-speed digital system applications. The GBN excited between the power and ground plane pair could be a source of interference to the adjacent analog IC's on the same PCB (or) nearby devices because of radiated emission from the PCB edges. Hence, it must be suppressed at the PCB level. The proposed two-dimensional IE-EBG patterned power plane suppressed the GBN effectively over a broad frequency range. The four unit-cell IE-EBG provides a -40 dB noise suppression bandwidth of 13.567 GHz. With a substantial increment in the overall area, the nine unit-cell IE-EBG provides a -50 dB bandwidth of 19.02 GHz. The equivalent circuit modeling was developed for nine unit-cell IE-EBG and results are verified with the 3D EM simulation results. In addition, dispersion analysis was performed on the IE-EBG unit-cell to validate the lowest cut-off frequency and bandgap range. The prototype model of the proposed IE-EBG is fabricated and tested. The measured and simulated results are compared; a negligible variation is observed between them. In a multilayer PCB, the solid power plane is replaced with the 1 x 4 IE-EBG power plane and its impact on high-speed data transmission is analyzed with single-ended/differential signaling. The embedded IE-EBG with differential signaling provides optimum MEO and MEW values of 0.928 V, 0.293 ns for a random binary sequence with the 0.1 ns rise-time. Compared to single-ended signaling, embedded IE-EBG with differential signaling maintain good signal integrity and supports high-speed data transmission.