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Article | Open Access

Thermodynamic and Thermoelastic Properties of SiSn: Data Mining-Based Searches and High Compression Effect

Rabie Mezouar1,2Fouad Okba3Dejan Zagorac4,5( )Salah Daoud2Abdelfateh Benmakhlouf 2
Institute of Optics and Precision Mechanics, Ferhat Abbas Setif 1 University, Setif, Algeria
Laboratory of Materials and Electronic Systems, Faculty of Sciences and Technology, University Mohamed El Bachir El Ibrahimi of Bordj Bou Arreridj, Bordj Bou Arreridj, Algeria
Architecture Department, Institute of Architecture and Earth Sciences, Ferhat Abbas Setif 1 University, Setif, Algeria
Centre of Excellence “CextremeLab”, Centre for Synthesis, Processing, and Characterization of Materials for Application in Extreme Conditions, University of Belgrade, Belgrade, Serbia
Department of Material Science, Vinča Institute of Nuclear Sciences—National Institute of the Republic of Serbia, University of Belgrade, Belgrade, Serbia
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Abstract

The compression effects on the thermoelastic and thermodynamic properties of cubic zincblende silicon–tin alloy (SiSn) were explored using a multi-methodological approach, deploying data mining methods, theoretical equation-of-state parameters, and the Quasi-Harmonic Debye Model. We analyze the relative volume, isothermal bulk modulus, thermal expansion coefficient, Debye temperature, sound velocity, and microhardness of the SiSn compound under pressures up to 8 GPa. The study commences with the data mining-based searches for a structural model and continues with an analysis of the pressure dependence of the relative volume using the Vinet equation of state, followed by an investigation of the bulk modulus and other related thermoelastic properties. Moreover, the variation of microhardness with temperature is predicted, demonstrating a patent progressive decline as the temperature rises from 0 to 800 K. The thermodynamic properties of the SiSn compound have been explored using the quasi-harmonic Debye model in temperatures ranging from 0 to 800 K and pressures ranging from 0 to 8 GPa, respectively. In addition to the information not found in the literature and offered by this study, our work also establishes a simplified model that can predict the evolution of microhardness as a function of temperature, firstly for the SiSn compound, and perhaps can extend to group-IV semiconductors.

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Computers, Materials & Continua

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Cite this article:
Mezouar R, Okba F, Zagorac D, et al. Thermodynamic and Thermoelastic Properties of SiSn: Data Mining-Based Searches and High Compression Effect. Computers, Materials & Continua, 2026, 88(1). https://doi.org/10.32604/cmc.2026.077724

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Received: 16 December 2025
Accepted: 09 April 2026
Published: 08 May 2026
© The Author 2026.

This work is licensed under a Creative Commons Attribution 4.0 International License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.