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Article | Open Access

LIRB-Based Quantum Circuit Fidelity Assessment and Gate Fault Diagnosis

Mengdi YangFeng YueWeilong WangXiangdong MengLixin WangPengyu HanHaoran HeBenzheng YuanZhiqiang FanChenhui WangQiming DuDanyang ZhengXuefei FengZheng Shan( )
Laboratory for Advanced Computing and Intelligence Engineering, Information Engineering University, Zhengzhou, 450001, China
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Abstract

Quantum circuit fidelity is a crucial metric for assessing the accuracy of quantum computation results and indicating the precision of quantum algorithm execution. The primary methods for assessing quantum circuit fidelity include direct fidelity estimation and mirror circuit fidelity estimation. The former is challenging to implement in practice, while the latter requires substantial classical computational resources and numerous experimental runs. In this paper, we propose a fidelity estimation method based on Layer Interleaved Randomized Benchmarking, which decomposes a complex quantum circuit into multiple sublayers. By independently evaluating the fidelity of each layer, one can comprehensively assess the performance of the entire quantum circuit. This layered evaluation strategy not only enhances accuracy but also effectively identifies and analyzes errors in specific quantum gates or qubits through independent layer evaluation. Simulation results demonstrate that the proposed method improves circuit fidelity by an average of 6.8% and 4.1% compared to Layer Randomized Benchmarking and Interleaved Randomized Benchmarking methods in a thermal relaxation noise environment, and by 40% compared to Layer RB in a bit-flip noise environment. Moreover, the method detects preset faulty quantum gates in circuits generated by the Munich Quantum Toolkit Benchmark, verifying the model’s validity and providing a new tool for faulty gate detection in quantum circuits.

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Computers, Materials & Continua
Pages 2215-2233

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Cite this article:
Yang M, Yue F, Wang W, et al. LIRB-Based Quantum Circuit Fidelity Assessment and Gate Fault Diagnosis. Computers, Materials & Continua, 2025, 82(2): 2215-2233. https://doi.org/10.32604/cmc.2024.058163

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Received: 05 September 2024
Accepted: 14 November 2024
Published: 28 February 2025
© The Author 2024.

This work is licensed under a Creative Commons Attribution 4.0 International License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.