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Open Access

Building a Post-Layout Simulation Performance Model with Global Mapping Model Fusion Technique

School of Integrated Circuits, Tsinghua University, Beijing 100084, China
Beijing Innovation Center for Future Chips (ICFC), Beijing National Research Center for Information Science and Technology(NRist), and School of Integrated Circuits, Tsinghua University, Beijing 100084, China
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Abstract

Building a post-layout simulation performance model is essential in closing the loop of analog circuits, but it is a challenging task because of the high-dimensional space and expensive simulation cost. To facilitate efficient modeling, this paper proposes a Global Mapping Model Fusion (GMMF) technique. The key idea of GMMF is to reuse the schematic-level model trained by the Artificial Neural Network (ANN) algorithm, and combine it with few mapping coefficients to build the post-simulation model. Furthermore, as an efficient global optimization algorithm, differential evolution is applied to determine the optimal mapping coefficients with few samples. In GMMF, only a small number of mapping coefficients are unknown, so the number of post-layout samples needed is significantly reduced. To enhance practical utility of the proposed GMMF technique, two specific mapping relations, i.e., linear or weakly no-linear and nonlinear, are carefully considered in this paper. We conduct experiments on two topologies of two-stage operational amplifier and comparator in different commercial processes. All the simulation data for modeling are obtained from a parametric design framework. A more than 5 × runtime speedup is achieved over ANN without surrendering any accuracy.

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Tsinghua Science and Technology
Pages 512-525

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Cite this article:
Wang Z, Hu W, Yin S, et al. Building a Post-Layout Simulation Performance Model with Global Mapping Model Fusion Technique. Tsinghua Science and Technology, 2022, 27(3): 512-525. https://doi.org/10.26599/TST.2021.9010042

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Received: 01 March 2021
Revised: 01 June 2021
Accepted: 02 June 2021
Published: 13 November 2021
© The author(s) 2022

The articles published in this open access journal are distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/).