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Research Article | Open Access | Just Accepted

Revealing the effect of indium on the ordering of PdCu in PdCu/PdIn heterostructure

Qianqian RenLianxi SiWenbo ZhaoSiyang WangAbrar AmnaShi Hu ( )

Department of Chemistry, School of Science, Tianjin Key Laboratory of Molecular Optoelectronic Science, Tianjin University, Tianjin 300072, China

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Abstract

The promotion of intermetallic compound (IMC) formation by a third element has emerged as a promising yet largely underexplored research topic; however, the specific regulation mechanism of the third element on IMC ordering and the influence of its doping content remain unclear. Herein, we comprehensively elucidate the intricate mechanism of indium (In)-induced PdCu ordering in PdCu/PdIn heterostructures. A unique “volcano-type” relationship between the ordering degree of Pd4Cu6Inx-300 (the annealed product of the Pd4Cu6Inx) and In doping content is reported, which originates from the competition between the kinetic promotion and thermodynamic inhibition effects induced by In doping during high-temperature annealing. The annealing process involves distinct sequential stages: Pd-In bond cleavage generates diffusible In atoms, and the high diffusivity of In atoms subsequently induce vacancy formation to accelerate the ordered rearrangement of Pd/Cu atoms. Notably, a critical and previously overlooked insight is that only diffusible In species can effectively modulate PdCu ordering, with a clear negative correlation between relative bonding strength of Pd-In and annealing-induced ordering degree. This study provides novel insights into the regulation of Pd-based IMCs formation by third-element doping, and provides vital guidance for the rational design of high-performance IMC materials and the optimization of their ordered microstructures.

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Cite this article:
Ren Q, Si L, Zhao W, et al. Revealing the effect of indium on the ordering of PdCu in PdCu/PdIn heterostructure. Nano Research, 2026, https://doi.org/10.26599/NR.2026.94908962

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Received: 21 April 2026
Revised: 19 June 2026
Accepted: 22 June 2026
Available online: 22 June 2026

© The Author(s) 2026. Published by Tsinghua University Press.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, https://creativecommons.org/licenses/by/4.0/)