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High-current reliability remains a key factor hindering the commercialization of AlGaN-based deep-ultraviolet light-emitting diodes (LEDs), primarily due to elusive defect-mediated degradation. Here, we investigated the spatial distribution and nature of defects induced by high current stress in 276 nm AlGaN-based LEDs grown on high-quality AlN. The results demonstrate that the stress-induced defects are generated within the p-type layer and the active region, particularly in areas of current crowding. A combined analysis using capacitance–voltage measurements, deep-level transient spectroscopy, and admittance spectroscopy reveals that p-layer degradation is driven by nitrogen vacancy (VN)-related defects originating from the dehydrogenation of hydrogen-passivated complexes. In the active region, the dominant stress-induced defects are identified as magnesium substituting gallium (MgGa), VN, gallium vacancy (VGa) complexes, and gallium-nitrogen vacancy (VGa-VN) complexes. These defects act as non-radiative recombination centers, enhancing non-radiative recombination and leading to a reduction in optical power. These findings suggest that mitigating hydrogen incorporation and optimizing current spreading are critical to high-current reliability of AlGaN-based deep-ultraviolet LEDs.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, https://creativecommons.org/licenses/by/4.0/).
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