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Review Article | Open Access | Just Accepted

Recent progress in gallium-based liquid metal particle composites for soft electronic applications

Yan Yang1Jia-Wei Liu1Yi Huang1Xi-Qiang Luo1Hong-Biao Sun1Yi-Zhi Liu2( )Jiang-Xin Wang1 ( )

1 School of Mechanical Engineering, Sichuan University, Chengdu 610065, China

2 School of Astronautics, Harbin Institute of Technology, Harbin 150001, China

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Abstract

Gallium-based liquid metals are emerging materials for soft electronics with their fluidic compliance, low toxicity, metallic conductivity, and outstanding thermal conductivity. Especially, liquid metal particles (LMPs) mixed with polymeric matrix have demonstrated promising application potentials for soft and stretchable electronic applications including stretchable integrated circuits, capacitive sensors, dielectric elastomer actuators, and thermal management materials. This review highlights methods to prepare LMPs, control and manipulate LMPs within the polymeric matrix to meet the demands of different functionalities. Furthermore, we summarized recent advances by utilizing LMP composites to enable different stretchable electronic applications. It is believed that LMP composites will serve as important enabling materials for the development of electronic skins, stretchable electronics, smart textiles, and next-generation human-machine interfaces. A comprehensive and timely review of the recent progress in LMP composites is expected to inspire further exploration and innovation in stretchable and multifunctional electronic systems.

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Review Status: {{reviewData.commendedNum}} Commended , {{reviewData.revisionRequiredNum}} Revision Required , {{reviewData.notCommendedNum}} Not Commended Under Peer Review

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Cite this article:
Yang Y, Liu J-W, Huang Y, et al. Recent progress in gallium-based liquid metal particle composites for soft electronic applications. Nano Research, 2026, https://doi.org/10.26599/NR.2026.94908871
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Received: 08 March 2026
Revised: 06 May 2026
Accepted: 25 May 2026
Available online: 25 May 2026

© The Author(s) 2026. Published by Tsinghua University Press.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, https://creativecommons.org/licenses/by/4.0/)