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Research Article | Open Access

In situ formation of high-entropy carbide phase in porous SiBCN ceramic for enhanced high-temperature stability

Zifeng Hu1Huijie Wang1Dong Su1,2( )
Key Laboratory of Advanced Ceramics and Machining Technology of Ministry of Education, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China
Tianjin Key Laboratory of Low-dimensional Electronic Materials and Advanced Instrumentation, Tianjin 300072, China
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Abstract

Porous SiBCN ceramics exhibit great potential in high-tech structural and functional applications. However, nucleation-crystallization and carbothermal decomposition limit their use in high-temperature environments. Herein, high-entropy carbide (HEC) (Ti0.25Zr0.25Hf0.25Ta0.25)C-modified porous SiBCN ceramics (HEC/SiBCN) were successfully fabricated from a multi-metal (Ti,Zr,Hf,Ta) precursor containing polyborosilazane via solvothermal methods, freeze-drying, and pyrolysis. The porous HEC/SiBCN ceramic possesses tailorable porosity (63.5%–79.1%), low thermal conductivity (0.054–0.089 W/(m·K)), and good mechanical strength. The HEC phase is in situ formed by carbothermal reduction and solid solution reaction of the multicomponent precursor with highly active free carbon in the SiBCN matrix during the pyrolysis, which endows the porous HEC/SiBCN ceramics with outstanding thermal stability up to 1800 °C. The in situ formation of the HEC phase provides novel insight and a promising strategy for enhancing the overall performance of porous SiBCN ceramics, expanding their application in high-temperature environments.

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Journal of Advanced Ceramics
Article number: 9221019

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Cite this article:
Hu Z, Wang H, Su D. In situ formation of high-entropy carbide phase in porous SiBCN ceramic for enhanced high-temperature stability. Journal of Advanced Ceramics, 2025, 14(2): 9221019. https://doi.org/10.26599/JAC.2024.9221019

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Received: 26 August 2024
Revised: 15 December 2024
Accepted: 16 December 2024
Published: 20 February 2025
© The Author(s) 2025.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, http://creativecommons.org/licenses/by/4.0/).