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Research Article | Open Access

Synergistic damage behavior of He ion irradiation and molten salt corrosion in SiC at 750 °C

Jianfeng Zhang1,2Lin Zhao1Jinlei Yang1Qiantao Lei1Jun Lin1Ya Tang2Jianjian Li1( )
Key Laboratory of Thorium Energy, Shanghai Institute of Applied Physics, Chinese Academy of Sciences, Shanghai 201800, China
Department of Chemistry, College of Sciences, Shanghai University, Shanghai 200444, China
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Abstract

CVD SiC samples exposed to 400 keV He ion irradiation at 750 °C were subsequently corroded in FLiNaK molten salt at 750 °C for 166 h. After corrosion, the dissolution of Si led to the formation of a carbon-rich layer and obvious denudation of the SiC. The microstructure of the C-rich layer was first visualized and characterized via TEM, confirming that a graphitic structure was present inside the layer. Furthermore, the AFM images indicate that the denudation depth increases with increasing irradiation dose. Moreover, the Ni impurities in the salt play a key role in the irradiation-promoted corrosion of SiC. These findings suggest that Ni can preferentially react with irradiation-included homonuclear Si‒Si bonds to promote SiC corrosion. Moreover, the number density of He bubbles decreases as their size increases near or within the C-rich layer, and it is speculated that the vacancies created by the loss of Si result in the migration and coalescence of He bubbles. In conclusion, irradiation and corrosion at high temperatures induced synergistic damage behavior in SiC.

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Journal of Advanced Ceramics
Pages 1786-1794

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Cite this article:
Zhang J, Zhao L, Yang J, et al. Synergistic damage behavior of He ion irradiation and molten salt corrosion in SiC at 750 °C. Journal of Advanced Ceramics, 2024, 13(11): 1786-1794. https://doi.org/10.26599/JAC.2024.9220975

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Received: 28 July 2024
Revised: 06 September 2024
Accepted: 23 September 2024
Published: 11 November 2024
© The Author(s) 2024.

This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, http://creativecommons.org/licenses/by/4.0/).