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It is well known that the grain size of high-entropy ceramics is quite small owing to the so-called sluggish diffusion effect. However, the abnormal grain growth behavior often occurs in high-entropy pseudobrookite ceramics, finally resulting in the formation of many abnormally grown grains with the grain size as large as 50 μm. To study this phenomenon, the grain growth behavior of high-entropy pseudobrookite ceramics is systematically investigated in this paper. The results demonstrate that the starting material powders firstly react with each other to form a high-entropy intermediate phase and calcined TiO2 powders (TiO2-1100 ℃), and then as the sintering temperature increases, the formed high-entropy intermediate phase further react with TiO2-1100 ℃ to form high-entropy pseudobrookite ceramics. Thus, in this system, besides the sluggish diffusion effect, the grain sizes of the high-entropy intermediate phase and TiO2-1100 ℃ also affect the morphology of high-entropy pseudobrookite. Compared to nano-sized TiO2, micron-sized TiO2 has lower sintering activity. Therefore, the high-entropy intermediate phase (Mg,Co,Ni,Zn)TiO3 and TiO2-1100 ℃ prepared with micron-sized starting materials exhibits lower grain sizes, finally resulting in the formation of high-entropy (Mg,Co,Ni,Zn)Ti2O5 with small grain size. What’s more, nano-indentation and thermal conductivity tests are carried out on high-entropy (Mg,Co,Ni,Zn)Ti2O5 with different morphologies. The results show that the hardness of high-entropy (Mg,Co,Ni,Zn)Ti2O5 increases from 6.05 GPa to9.95 GPa as the grain size refinement, whereas thermal conductivity decreases from 2.091±0.006 Wm-1K-1 to 1.583±0.006 Wm-1K-1. All these results indicate that high-entropy (Mg,Co,Ni,Zn)Ti2O5 with small grain size is a potential material for thermal protection.

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Publication history

Received: 24 January 2024
Revised: 08 April 2024
Accepted: 08 April 2024
Available online: 09 April 2024

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© The Author(s) 2024.

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The articles published in this open access journal are distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/).

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