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Aluminum nitride (AlN) is considered one of the most desirable materials for integrated circuits and electronic packaging substrates. However, raw AlN powder reacts easily with water, forming Al(OH)3 or AlOOH on the surface and hindering the development of an aqueous tape-casting process for preparing AlN ceramic substrates. In this study, hydrolyzed polymaleic anhydride (HPMA) was used to modify AlN powder, which has good water solubility and dispersibility. The AlN powder was modified with 5 wt% HPMA remained stable in water for at least 90 h under magnetic stirring condition and 24 h under ball milling condition, indicating that HPMA-modified AlN powder has good resistance to hydrolysis. The action mechanism of HPMA is revealed. Firstly, –COOH of the HPMA polymer and the oxide layer on the surface of the AlN powder underwent a dehydration condensation reaction to form a compound. Secondly, long chains of the polymer further coated the surface of the AlN powder, forming an anti-hydration layer with a thickness of about 7.0 nm on the surface of the AlN particles. In addition, AlN green sheets were successfully prepared by aqueous tape casting using the HPMA-modified AlN powder without additional dispersants. Subsequently, AlN ceramic substrates were obtained by sintering at 1750 ℃ for 4 h under an N2 atmosphere with a pressure of 0.2 MPa. The relative density and thermal conductivity were tested to be 97.3% and 122 W/(m·K), respectively.


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HPMA modified aluminium nitride powder for aqueous tape casting of AlN ceramic substrates

Show Author's information Meng Lia,bJianping Aia( )Zhengjuan Wangb( )Zhenhai XuebLihong ChengaGuohong ZhoubShiwei Wangb
School of Materials and Mechatronics, Jiangxi Science & Technology Normal University, Nanchang 330038, China
State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China

Abstract

Aluminum nitride (AlN) is considered one of the most desirable materials for integrated circuits and electronic packaging substrates. However, raw AlN powder reacts easily with water, forming Al(OH)3 or AlOOH on the surface and hindering the development of an aqueous tape-casting process for preparing AlN ceramic substrates. In this study, hydrolyzed polymaleic anhydride (HPMA) was used to modify AlN powder, which has good water solubility and dispersibility. The AlN powder was modified with 5 wt% HPMA remained stable in water for at least 90 h under magnetic stirring condition and 24 h under ball milling condition, indicating that HPMA-modified AlN powder has good resistance to hydrolysis. The action mechanism of HPMA is revealed. Firstly, –COOH of the HPMA polymer and the oxide layer on the surface of the AlN powder underwent a dehydration condensation reaction to form a compound. Secondly, long chains of the polymer further coated the surface of the AlN powder, forming an anti-hydration layer with a thickness of about 7.0 nm on the surface of the AlN particles. In addition, AlN green sheets were successfully prepared by aqueous tape casting using the HPMA-modified AlN powder without additional dispersants. Subsequently, AlN ceramic substrates were obtained by sintering at 1750 ℃ for 4 h under an N2 atmosphere with a pressure of 0.2 MPa. The relative density and thermal conductivity were tested to be 97.3% and 122 W/(m·K), respectively.

Keywords: aluminum nitride (AlN), surface modification, hydrolysis resistance, aqueous tape casting, hydrolyzed polymaleic anhydride (HPMA)

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Publication history
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Publication history

Received: 11 April 2023
Revised: 20 June 2023
Accepted: 20 June 2023
Published: 05 September 2023
Issue date: September 2023

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© The Author(s) 2023.

Acknowledgements

This work was financially supported by the National Natural Science Foundation of China (Nos. 52102101, 52267001), and the Natural Science Foundation of Jiangxi Province (No. 20212BAB204019).

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