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Review | Open Access

Flexible inorganic piezoelectric functional films and their applications

Liyun Zhena,b, Lijun Lua,b, Yongtao Yaoc, Jingquan Liua, Bin Yanga ( )
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Shanghai Jiao Tong University, Shanghai 200240, China
Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin 150001, China
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Abstract

Piezoelectric materials play an increasingly important role in energy harvesters, sensors, and actuators. Flexible and thin piezoelectric films have been demonstrated to provide advanced functionalities and improved performances. However, the research on flexible inorganic piezoelectric thin films has rarely been systematically summarized. Here, we summarize the recent advances in the flexible inorganic piezoelectric thin films, focusing on their structural designs, fabrication techniques, and applications in various practical scenarios. Specifically, different fabrication techniques suitable for diverse inorganic piezoelectric nanostructures are reviewed, including sol–gel, hydrothermal, electrospinning, and other techniques, and the integration process with flexible substrates is further discussed. Biomedical and industrial applications of the flexible piezoelectric thin films are emphasized. Finally, some existing challenges and future perspectives are discussed.

Keywords

inorganic piezoelectric thin filmsfabrication techniquesstructural designflexible electronics

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Journal of Advanced Ceramics
Volume 12 Issue 3,
March 2023
Pages 433-462
DOI: 10.26599/JAC.2023.9220691
Cite this article:
Zhen L, Lu L, Yao Y, et al. Flexible inorganic piezoelectric functional films and their applications. Journal of Advanced Ceramics, 2023, 12(3): 433-462. https://doi.org/10.26599/JAC.2023.9220691

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Received: 01 August 2022
Revised: 30 October 2022
Accepted: 31 October 2022
Published: 22 February 2023
© The Author(s) 2022.

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