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Open Access

Review of Hybrid Packaging Methods for Power Modules

Puqi Ning1,2( ), Xiaoshuang Hui1,2, Yuhui Kang1,2, Tao Fan1,2, Kai Wang1, Yunhui Mei3, Guangyin Lei4
Institute of Electrical Engineering, Chinese Academy of Sciences, Beijing 100190, China
University of Chinese Academy of Sciences, Beijing 100049, China
School of Electrical Engineering, Tiangong University, Tianjin 300387, China
Academy for Engineering and Technology, Fudan University, Shanghai 200433, China
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Abstract

The hybrid structure of a power-module package is summarized and classified. Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar modules, respectively. The automatic layout method can improve the electrical and thermal performance of hybrid structures. A state-of-the-art hybrid structure is introduced, and suggestions for alleviating the current and temperature imbalances for future designs are provided.

Graphical Abstract

The hybrid structure of a power-module package is summarized and classified. Basic and extended planar wire-bond designs are analyzed and compared with regular wire-bond modules and planar modules, respectively. The automatic layout method can improve the electrical and thermal performance of hybrid structures. A state-of-the-art hybrid structure is introduced, and suggestions for alleviating the current and temperature imbalances for future designs are provided.

Keywords

Junction temperature monitoringIGBTconduction voltage

References

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Chinese Journal of Electrical Engineering
Volume 9 Issue 4,
December 2023
Pages 23-40
DOI: 10.23919/CJEE.2023.000040

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Review Status: {{reviewData.commendedNum}} Commended , {{reviewData.revisionRequiredNum}} Revision Required , {{reviewData.notCommendedNum}} Not Commended Under Peer Review

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Cite this article:
Ning P, Hui X, Kang Y, et al. Review of Hybrid Packaging Methods for Power Modules. Chinese Journal of Electrical Engineering, 2023, 9(4): 23-40. https://doi.org/10.23919/CJEE.2023.000040

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Received: 12 July 2023
Revised: 14 August 2023
Accepted: 18 October 2023
Published: 06 December 2023
© 2023 China Machinery Industry Information Institute