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Review

Recent Development on High Thermal Conductivity Diamond Synthesized by Microwave Plasma Chemical Vapor Deposition and Its Devices Applications

Jiwen ZHAO1Xiaobin HAO1Kechen ZHAO1Yicun LI1Sen ZHANG1Kang LIU1Bing DAI1Huaixin GUO2Jiecai HAN1Jiaqi ZHU1,3 ( )
National Key Laboratory of Science and Technology on Advanced Composites in Special Environments, Harbin Institute of Technology, Harbin 150080, China
Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Devices Institute, Nanjing 210016, China
Key Laboratory of Micro-Systems and Micro-Structures Manufacturing Ministry of Education, Harbin Institute of Technology, Harbin 150080, China
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Abstract

In the application of the third-generation semiconductors, the power density of electronic devices increases and the size is miniaturization. A problem of high temperature becomes more prominent. Diamond is one of the optimum heat dissipation materials because of its ultra-high thermal conductivity and stable properties. In this review, the design principle and development process of different microwave plasma chemical vapor deposition equipment were introduced. Recent developments on different thermal applications of single crystal, polycrystalline and nanocrystal diamond were represented.Some challenges in the industrialization process combined with the 3rd-generation-semiconductors and the development direction of "larger, purer and faster" were summarized. In addition, the future research direction of diamond heat dissipation application was also prospected.

CLC number: O799 Document code: A Article ID: 0454-5648(2022)07-1852-13

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Journal of the Chinese Ceramic Society
Pages 1852-1864

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Cite this article:
ZHAO J, HAO X, ZHAO K, et al. Recent Development on High Thermal Conductivity Diamond Synthesized by Microwave Plasma Chemical Vapor Deposition and Its Devices Applications. Journal of the Chinese Ceramic Society, 2022, 50(7): 1852-1864. https://doi.org/10.14062/j.issn.0454-5648.20220073

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Received: 25 January 2022
Revised: 03 March 2022
Published: 30 May 2022
© 2022 Journal of the Chinese Ceramic Society