Preparation and properties of a thermal-photo dual-curing acrylic resin tack-reducing adhesive

Using 2-ethylhexyl acrylate, butyl acrylate, methyl methacrylate, and acrylic acid as the main monomers, with hydroxyethyl acrylate and isocyanoethyl methacrylate as the functional and grafting monomers, respectively, and dibenzoyl peroxide (BPO)/azo diisobutyronitrile (AIBN) as the complex initiation system, a thermophoto dual-curing acrylic resin material has been prepared under solution polymerization conditions for use as a tack-reducing adhesives used in wafer processing. The material can be thermally cured into a film in the presence of an isocyanate curing agent to provide the adhesive strength necessary for wafer fixation. Furthermore the double bond introduced by grafting can be cured a second time under UV irradiation, giving UV tack reduction, in order to realize the peeling of the resin from the chip after processing. The structures and peeling properties of the synthetic resin were systematically studied. The BPO/AIBN ratio has a significant effect on the degree of molecular chain branching, which allows for the tailoring of the peeling strength before and after UV curing.