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To address the heat dissipation challenges associated with high power density in intelligent computing centers, this study proposes an air-liquid dual source cooling system. The system utilizes a unified cold source with a stepwise water flow sequence of "air-cooling first, liquid-cooling second" to reduce exergy loss and match the temperature-grade of the respective cold source. The internal flow channel of the cooling unit was optimized through computational fluid dynamics simulations, and its performance was experimentally tested under high-temperature with high-humidity, moderate-temperature with moderate-humidity, and low-temperature conditions.Results indicate that the optimized unit achieves an outlet water temperature as low as 32.17 ℃ with a maximum coefficient of performance (COP) of 28.03 under high-temperature conditions. The unit also enables complete natural cooling under moderate conditions and reaches a peak COP of 33.4 under low-temperature conditions while maintaining stable operation. The system's overall approach degree ranges from 0.1 ℃ to 1.8 ℃, and its cooling capacity reaches 105.3%, outperforming the national standard. This study provides an efficient and practical cooling solution for high-density intelligent computing centers.
This is an open access article under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0, http://creativecommons.org/licenses/by/4.0/).
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