Key Technological Challenges and Collaborative Innovation Pathways of China's Integrated Circuits

Against the backdrop of intensified global technological rivalry and restrictions on critical technologies, the Integrated Circuit (IC) industry has become central domain of national strategic security and technological self-reliance. This paper systematically reviews the development status of China's IC industry chain, focusing on key bottlenecks in design, manufacturing, Electronic Design Automation (EDA) tools, and advanced packaging. Based on an analysis of external pressures such as U.S.-led technology embargoes and internal structural weaknesses, the authors identify the dual challenges faced by the industry. Combined with the latest research practice in Artificial Intelligence (AI) hardware accelerators, hardware/software co-design, device modeling and simulation, and AI-assisted EDA, this paper proposes a technology breakthrough path driven by collaborative innovation, and explores new directions in computing architecture, system packaging, and EDA design under the post-Moore paradigm. This paper provides theoretical support and practical references for technological innovation and policy formulation in the integrated circuit field.