Preparation and Bonding Properties of Super Antioxidant Copper Paste

In order to realize the wide application and improve the performance of third-generation semiconductor devices, the development of new and high-performance packaging interconnect materials has become a key initiation. Among them, micro/nano copper material can be sintered into block structures with high electrical conductivity, high thermal conductivity, high stability and electromigration resistance under low temperature conditions due to its surface effect and small size effect, which has become a research hotspot for the development of new packaging interconnect materials. However, the problems of easy oxidation, agglomeration and low yield of micro/nano copper material limit its application in third-generation semiconductor devices, and the oxidation resistance improvement of micro/nano copper material has become a key problem to solve its application. In this research, benzimidazole was used to treat micro/nano copper material, and the coating of micro/nano copper particles by benzimidazole was confirmed by Scanning Electron Microscope (SEM) , infrared spectroscopy and other characterization methods. The copper paste was subjected to X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) to prove that the paste could be left in air for 120 days without oxidation. The strength of the interconnect joint prepared at 300 °C reached 62.3 MPa, and the resistivity of the sintered layer was as low as 6.18×10⁻⁸ Ω·m. The results show that the method of treating micro/nano copper material by benzimidazole can help it to achieve super oxidation resistance and good interconnection performance, which is of profound significance for the research and development of third-generation semiconductor packaging interconnect materials.