Research and Application Progress of Composite Polyimide with Low Dielectric Properties

With excellent mechanical properties and heat resistance, polyimide has been one of the important dielectric materials in microelectronics industry. In recent years, with the rapid development of microelectronics industry and the rise of 5G communication technology, higher requirements are put forward for the dielectric constant and dielectric loss reduction of polyimide in terms of energy consumption requirements and signal reception. How to reduce as much as possible the dielectric constant and dielectric loss and retain the excellent properties of polyimide at the same time is an urgent problem to solve at present. The research and application progress of porous polyimides, polymers filler and inorganic nano filler composite modified polyimides and other composite low dielectric polyimides emerging in recent years are reviewed. How to reduce the dielectric constant of polyimides while maintaining other properties is discussed, and its development is prospected. It will provide a new idea for the design and preparation of new composite low dielectric polyimide materials.