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Review | Open Access

Metal semiconductor materials in bone diseases: properties, applications, and future perspectives

Wenshuang Sun1,Yizhang Wu2, Jia Sha1,Xueru Song3Ziying Sun1Xi Cheng1Tao Yuan1Hong Qian1Xiaojiang Yang1Zhao Tang1Yueying Chen1Xinrui Sun1Liang Wang4Jia Meng1( )Zhongyang Lv1 ( )Nirong Bao1( )
Department of Orthopedics, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210002, China
Department of Applied Physical Sciences, The University of North Carolina at Chapel Hill, 125 south road, Chapel Hill, 27517 North Carolina, United States
Department of Medical Oncology, Nanjing Jinling Hospital, Affiliated Hospital of Medical School, Nanjing University, No. 305 Zhongshan East Road, Xuanwu District, Nanjing 210000, China
Department of Orthopedics, the 902nd Hospital of PLA Joint Logistic Support Force, No. 1052 Yanshan Road, Yuhui District, Bengbu, Anhui Province, China

Wenshuang Sun, Yizhang Wu, and Jia Sha contributed equally to this work.

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Highlights

• This is the first comprehensive review of metal semiconductors as multifunctional bone tissue engineering platforms that integrate osteogenic, antibacterial, imaging, drug delivery, and photothermal therapy effects into a unified system.

• This study highlights the electrophysiological mechanisms by which metal semiconductors rebuild the bone microelectric field on the basis of piezoelectric/conductive properties, Ca2+ channel modulation, osteogenic signaling, and immune cell polarization to offer new therapeutic targets.

• A translational roadmap that features biodegradable metal semiconductors, 3D-printed personalized scaffolds, and stimuli-responsive release strategies is established to bridge laboratory research with clinical practice.

• Examples of device-integrated designs, such as surface coatings, smart scaffolds, and nanodrug carriers, that reduce stress shielding and infection risk while enhancing osseointegration are discussed.

• Future directions that emphasize interdisciplinary collaboration, long-term biocompatibility assessments, and patient-specific customization are identified to lay theoretical and technical foundations for next-generation orthopedic implants.

Abstract

The objective of bone tissue engineering is to develop innovative biomaterials and stimulation strategies to promote bone regeneration. Bioelectric materials play a crucial role in this domain owing to their inspiration of the inherent piezoelectric properties of bone. This review explores the progress made in utilizing metal semiconductor materials for bone tissue engineering, focusing on their operating mechanisms, various material classifications, and the ways they foster bone regeneration. First, the working principles of metal semiconductor materials are discussed, with an emphasis on the importance of bioelectric phenomena in regulating cell behavior. Owing to their roles in mimicking the electrophysiological microenvironment to promote bone regeneration, we highlight various types of metal semiconductor materials, such as metallic semiconductor materials, piezoelectric materials, and conductive biomaterials. Personalized and specific materials, including conductive smart scaffolds, modified implant surfaces, and those that target bone tissues, promote osseointegration and exert antibacterial properties, serving diverse applications in bone tissue engineering. Additionally, to improve implant biocompatibility and osseointegration, the use of metal semiconductor materials in the design of orthopedic implants has shown promising clinical application prospects. Finally, looking forward to the future applications of metal semiconductor materials in bone engineering, integrating multiple functions, personalized medicine, and biodegradable materials, as well as the application of nanotechnology and 3D printing techniques, may arise to satisfy clinical requirements. This review also presents the biological characteristics of metal semiconductor materials and their recent applications in treating bone diseases, while also discussing innovative concepts for their design and development.

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Burns & Trauma
Article number: tkaf055

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Cite this article:
Sun W, Wu Y, Sha J, et al. Metal semiconductor materials in bone diseases: properties, applications, and future perspectives. Burns & Trauma, 2025, 13(10): tkaf055. https://doi.org/10.1093/burnst/tkaf055

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Received: 24 March 2025
Revised: 11 August 2025
Accepted: 11 August 2025
Published: 12 August 2025
© The Author(s) 2025. Published by Oxford University Press.

This is an Open Access article distributed under the terms of the Creative Commons Attribution-NonCommercial License (https://creativecommons.org/licenses/by-nc/4.0/), which permits non-commercial re-use, distribution, and reproduction in any medium, provided the original work is properly cited. For commercial re-use, please contact reprints@oup.com for reprints and translation rights for reprints. All other permissions can be obtained through our RightsLink service via the Permissions link on the article page on our site—for further information please contact journals.permissions@oup.com.