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Research Highlight | Open Access

In situ shape-shifting from 2D patch to 1D fiber enables minimally invasive bio-integrated electronics

Hyunjin Jung1,2,§ , Sungjun Yoon2,3,§, Donghee Son2,3 ( )
Department of Electrical and Computer Engineering, Sungkyunkwan University (SKKU), Suwon, Republic of Korea
Center for Neuroscience Imaging Research, Institute for Basic Science (IBS), Suwon, Republic of Korea
Department of Chemical and Biomolecular Engineering, Yonsei University (YU), Seoul, Republic of Korea

§ These authors contributed equally to this work and should be considered co-first author.

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International Journal of Extreme Manufacturing
Volume 8 Issue 4,
August 2026
DOI: 10.1088/2631-7990/ae5138

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Cite this article:
Jung H, Yoon S, Son D. In situ shape-shifting from 2D patch to 1D fiber enables minimally invasive bio-integrated electronics. International Journal of Extreme Manufacturing, 2026, 8(4). https://doi.org/10.1088/2631-7990/ae5138

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Received: 03 January 2026
Revised: 31 January 2026
Accepted: 11 March 2026
Published: 24 March 2026
© 2026 The Author(s).

Original content from this work may be used under the terms of the Creative Commons Attribution 4.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.