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Paper | Open Access

Monolithic 3D micro-encapsulation on optical fiber tips via femtosecond laser direct writing

Xuhao Fan1,4,§ , Liangye Li1,2,5,§, Zongjing Li1, Zhi Zhang1,2, Zexu Zhang1, Xinger Wang1, Shaoxi Shi1, Hui Gao1,3 , Yinghui Quan5, Qizhen Sun1,2,3 ( ), Wei Xiong1,3 ( )
Wuhan National Laboratory for Optoelectronics and School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, People’s Republic of China
National Engineering Research Center for Next Generation Internet Access System (NGIA), School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, People’s Republic of China
Optics Valley Laboratory, Wuhan 430074, People’s Republic of China
Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Shatin, Hong Kong Special Administrative Region of China, People’s Republic of China
School of Information Mechanics and Sensing Engineering, Xidian University, Xi’an 710071, People’s Republic of China

§ These authors contributed equally to this work and should be considered co-first-author.

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Abstract

Multifunctional integration of optical fiber tips has attracted tremendous attention because of the high sensitivity, compact size, and immunity to electromagnetic interference of fiber-optic devices. However, achieving stable three-dimensional (3D) micro-structuring while maintaining both miniaturization and sensing performance remains a persistent challenge. Here, we present a monolithic 3D micro-encapsulation strategy based on femtosecond laser direct writing (FsLDW) and chemical vapor polymerization (CVP), enabling the multifunctional integration of Fabry–Pérot interferometers (FPIs) on fiber tips with submicron precision and enhanced structural robustness. This approach combines an FsLDW-nanoprinted air cavity with the CVP of the Parylene C coating, reducing the overall sensor footprint from the centimeter scale to approximately 100 μm without compromising sensing performance. As a proof of concept, we demonstrate the stable operation of encapsulated optical fiber sensors under continuous fluidic and mechanical disturbances, supporting both intensity and wavelength demodulation. The encapsulated FPI cavities achieve over an order of magnitude improvement in spectral stability and a 26.4 dB increase in long-term signal contrast, with performance sustained over 10000 repeated test cycles. This work offers a scalable route toward high-density, multifunctional fiber–optic sensors with enhanced durability and long-term reliability for next-generation photonic integrated applications.

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International Journal of Extreme Manufacturing

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Cite this article:
Fan X, Li L, Li Z, et al. Monolithic 3D micro-encapsulation on optical fiber tips via femtosecond laser direct writing. International Journal of Extreme Manufacturing, 2026, 8(4). https://doi.org/10.1088/2631-7990/ae4e6f

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Received: 15 July 2025
Revised: 31 October 2025
Accepted: 06 March 2026
Published: 10 April 2026
© 2026 The Author(s).

Original content from this work may be used under the terms of the Creative Commons Attribution 4.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.